Unimicron Technology Corporation

Mitac Technology Corporation

Chih-Kai Chan

Ra-Min Tain

Shih-Lian Cheng

Chih-Chiang Lu

Heng-Ming Nien

Jun-Ho Chen

An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

Electronic packaging structure and manufacturing method thereof

An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.

Electroplating apparatus and electroplating method

A signal filtering system for a computer system remote controller. The system includes a remote controller, a filtering control enabling unit, and a keyboard encoder. The filtering control enabling unit sets a filtering pin, enabling a keyboard encoder receiving a function signal from the remote controller to filter the signal, selectively transmitting the function signal to a computer system.

Growing community of inventors

Taoyuan, Taiwan

Chih-Kai Chan