United Microelectronics Corp.

Other

2X Memory Technology Corp.

Targps Technology Corp.

Chih-Jen Huang

Shih-Fang Hong

Chien-Hung Chen

Chao-Yuan Su

Gary Y Hong

Hwi-Huang Chen

Wei-Lun Hsu

Te-Yuan Wu

Ching-Ming Lee

Tun-Jen Cheng

Jin-Tau Chou

Pao-Chuan Lin

Chung-Chiang Lin

Chun-Hsiung Peng

Ji-Wei Liou

Chia-Te Wu

Shih-Ming Shu

Auter Wu

A memory correcting method includes steps: providing a memory with a plurality of memory bytes; respectively adding a plurality of correcting bytes to the plurality of memory bytes; providing a plurality of non-volatile compared memory bytes; detecting whether there are any underperforming bits in the plurality of memory bytes, the plurality of correcting bytes, and the plurality of compared memory bytes of the memory to complete the correction. Alternatively, the method respectively provides a plurality of compared memory address bytes for the plurality of memory bytes and for the plurality of correcting bytes for labeling underperforming-bit addresses. Then, the method detects whether there are any underperforming bits in the plurality of memory bytes, the plurality of correcting bytes, and the plurality of compared memory address bytes of the memory to complete the correction.

Memory correcting method

A semiconductor structure for a wide bandgap normally off MOSFET has a III-group nitride, a V-group nitride, or a high K material trapping layer disposed under a gate electrode. Through the FN tunneling effect or channel hot electron (CHE) effect, multiple electrons are trapped by the trapping layer and kept in the trapping layer. The electrons in the trapping layer deplete the two-dimensional electron gas (2DEG) below the trapping layer, and then the 2DEG below the gate electrode disappear.

Semiconductor structure for wide bandgap normally off MOSFET

A method for self-terminated writing with quasi-constant voltage drop across resistive-type memory cell is provided. The method comprises: creating a writing voltage and a writing current flowing through a resistive memory cell; reproducing the writing current to generate a reproduced writing current; flowing the reproduced writing current through a dummy circuit to generate a dummy writing voltage; adding the dummy writing voltage and a reference voltage to generate a reference writing voltage, wherein the dummy writing voltage slightly and proportionally increases during writing; and adjusting the writing voltage and the writing current according to the reference writing voltage so that a voltage drop across the resistive memory cell keeps constant or slightly increases during writing. When the reproduced writing current reaches a predetermined target current value, a termination signal is issued. The termination signal turns off the related writing circuits to optimize the writing period of the resistive-type memory cell.

Method for self-terminated writing with quasi-constant voltage across resistive-type memory element and circuit thereof

A bit-scale memory correcting method comprises steps: providing a memory with a plurality of memory bytes each having M bits, wherein M is a positive integer; adding a correcting byte to each memory byte, wherein the correcting byte has N correcting bits, and wherein N is a positive integer and smaller than M; detecting whether there is any underperforming bit in all the memory bytes and correcting bytes; if no, terminating memory correction; if yes, using the non-underperforming bits of the correcting byte to replace the underperforming bits of the memory byte, wherein the quantity of the non-underperforming bits of the correcting byte is corresponding to the quantity of the underperforming bits of the memory byte. The present invention proposes a simple and fast memory bit correcting method to decrease the redundant bits for correcting memory bits.

Bit-scale memory correcting method

A nonvolatile memory device and a manufacturing method thereof are provided. The manufacturing method includes the following steps. First, a substrate is provided. Then, a tunneling dielectric layer is formed on the substrate, and a dummy gate is form on the tunneling dielectric layer. Subsequently, an interlayer dielectric layer is formed around the dummy gate, and the dummy gate is removed to form an opening. Following that, a charge storage layer is formed on the inner side wall of the opening, and the charge storage layer covers the tunneling dielectric layer. Moreover, an inter-gate dielectric layer is formed on the charge storage layer, and a metal gate is formed on the inter-gate dielectric layer. Accordingly, a stacked gate structure of the nonvolatile memory device includes the tunneling dielectric layer, the charge storage layer, the inter-gate dielectric layer, and the metal gate.

Nonvolatile memory device with a high-K charge storage layer having a U-shaped,cross-sectional structure

A method of manufacturing flash memory device is provided and includes the following steps. First, a substrate is provided. Then, a stacked gate structure is formed on the substrate. Subsequently, a first oxide layer is formed on the stacked gate structure. Following that, a nitride spacer is formed on the first oxide layer, wherein a nitrogen atom-introducing treatment is performed after the forming of the first oxide layer and before the forming of the nitride spacer. Accordingly, the nitrogen atom-introducing treatment of the presentation invention can improve the data retention reliability of the flash memory device.

Method of manufacturing flash memory device

A HV MOS transistor device having a substrate, a gate, a source, a drain, a first ion well of a first conductive type disposed in the substrate, and a plurality of field plates disposed on the substrate is disclosed. The HV MOS transistor device further has a first doped region of a second conductive type positioned in the first ion well. Therefore, a first interface and a second interface between the first ion well and the first doped region are formed, and the first interface and the second interface are respectively positioned near the drain and the source. In addition, the first interface is positioned under a respective field plate to produce a smooth field distribution and to increase the breakdown voltage of the HV transistor device.

High-voltage MOS transistor device

A high-voltage transistor device has a substrate, an isolation structure, a source, a gate, a drain, a plurality of doped regions, a plurality of ion wells, and a first dielectric layer disposed on the substrate. The high-voltage transistor device further has a first conductive layer and a plurality of first field plate rings. The first conductive layer is electrically connected to the drain and at least one of the first field plate rings.

The present invention provides a non-volatile memory cell structure suitable for the flash memory cell and EEPROM cell (electrically erasable programmable read only memory cell) to perform the byte programming and byte erasing operations. In the programming operation, a higher negative voltage applied to the drain region, such that the hot holes is generated to induce the hot electrons into the floating gate through the tunneling oxide layer in the lateral electrical field. In addition, the gate voltage is around the threshold voltage, which dependent on the integration circuit device design. Furthermore, the non-volatile memory cell utilized the channel Fowler-Nordheim tunneling for erasing operation. In order to perform the byte erasing operation, the drain junction used as an inhibition switch. Thus, the unselected cell in the same word line is inhibited by biasing the drain to ground. Therefore, the word lines of unselected cells are grounded.

Non-volatile memory technology suitable for flash and byte operation application

A method for operating a non-volatile memory device, which is applicable to an n-channel non-volatile memory device, wherein a positive voltage is applied to the control gate, a negative voltage is applied to the drain region while the source region is floating. Furthermore, a negative voltage is applied to the substrate to program to the n-channel memory device by the channel Fowler-Nordheim tunneling effect. To erase the n-channel non-volatile memory device, a negative voltage is applied to the control gate, a positive voltage is applied to the drain region, and the source region is floating. Moreover, a positive voltage is applied to the substrate to erase the n-channel memory device using the channel Fowler-Nordheim tunneling effect.

Method for operating a non-volatile memory

A method of fabricating a trenched flash memory cell is provided. A plurality of shallow trench isolation structures are formed to enclose at least an active area in a silicon substrate. A doped region is formed in the silicon substrate, followed by the deposition of an isolation layer on the silicon substrate. A first photo and etching process (PEP) is performed to form two trenches within the active area. A tunnel oxide layer, a floating gate, and ONO dielectric layer are formed in the trenches, respectively. A doped polysilicon layer is then formed on the silicon substrate to fill the trenches, followed by the removal of a portion of the doped polysilicon layer to form two controlling gates in the active area. Next, a self-alignment common source is formed between the two controlling gates and a plurality of spacers are formed on either side of each controlling gate. Finally, a silicide layer is formed on the surfaces of the controlling gates and the common source.

Method of fabricating a trenched flash memory cell

A method of manufacturing a high voltage device is described. A well region is formed within a substrate of a high voltage device region. A gate structure is made up of a gate oxide layer, a gate and an optional cap layer that are sequentially formed upon the well. Subsequently, using the gate structure as a mask, a large tilt angle light doping process is performed on the well of the high voltage device region of the well, thereby forming a lightly doped source and drain region. Thereupon, a optional thermal drive-in procedure is performed. Next, a spacer is formed on the side of the gate structure. Using the spacer and the gate structure as a mask, a heavy doping self-aligned ion implantation process is performed on the active region of the well, thereby forming a heavily doped source and drain region.

Method of manufacturing a high voltage using a latid process for forming a LDD

A method for fabricating a non-volatile memory on the semiconductor substrate is disclosed. First of all, a plurality of trench isolation regions are formed. Then, firstly implanting ions of a first conductivity type and second conductivity type are carried out. Secondly implanting ions of the first conductivity type and second conductivity type are carried out. Then, a first oxide layer is deposited and the first oxide layer is removed. A second oxide layer is deposited. A portion of second oxide is removed, thus, a portion of second oxide layer is remained. A third oxide layer is formed. A first polysilicon layer is formed. The first polysilicon layer is etched. A oxide-nitride-oxide layer is formed. Consequentially, the oxide-nitride-oxide layer are all etched. The second polysilicon on is formed. A portion of the second polysilicon layer, a portion of the first polysilicon layer, a portion of the third oxide layer and a portion of the second oxide layer are all etched. Thus, capacitor columns are formed.

Method for implementing non-volatile memory on a semiconductor substrate

A method of fabricating a semiconductor device with various thicknesses of the gate oxide layers is described, which method is applicable to a substrate having a first region and a second region, wherein the first region has a first conductive layer to isolate the first gate oxide layer from the substrate. Thereafter, a first oxide layer/nitride layer is formed on the first conductive layer, followed by forming a doped polysilicon layer on the first oxide layer/nitride layer, wherein the doped polysilicon layer is not formed in the second region. Subsequently, a second gate oxide layer is formed on the substrate of the second region, whereas a first oxide layer/nitride layer/second oxide layer is concurrently converted from the oxide layer/nitride layer/doped polysilicon layer. A defined second conductive layer is then formed on the first oxide layer/nitride layer/second oxide layer and the second gate oxide layer.

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Hsinchu, Taiwan

Chih-Jen Huang