Taiwan Semiconductor Manufacturing Comp. Ltd.

Nuvoton Technology Corporation

National Cheng-kung University

Eever Technology, Inc.

Industrial Technology Research Institute

Acer Inc.

Other

Realtek Semiconductor Inc.

Inventec Corp.

Wacom Co., Ltd.

Sitronix Technology Corporation

Tamkang University

Optoma Corporation

Universal Cement Corporation

Kai Chih Industrial Co., Ltd.

Chih-Hung Huang

Jiun-Rong Pai

Yang-Ann Chu

Hsuan Lee

Cheng-Lung Wu

Tsung-Sheng Kuo

Hao-Yang Chang

Yi-Fam Shiu

Chun-Wei Chiu

Yu-Chen Chen

Guan-Wei Huang

Hsu-Shui Liu

Kang-Fu Chiu

Fan-Tien Cheng

Yu-Lung Lo

Haw-Ching Yang

Hung-Chang Hsiao

Shyh-Hau Wang

Min-Chun Hu

Chueng-Jen Wang

Chih-Sheng Hou

Chien-Cheng Kuo

Shih-Min Hsu

I-Lun Yang

Ping-Yung Yen

Chung-Hsin Chien

Zheng-Lin He

Fiona H Lee

Wen-Chung Chiang

Kin-Lu Wong

Chih-Chun Liu

Ming-Hsien Tsai

Yu-Bing Liou

Chang-Chou Li

Yu-Chi Wang

Kuo-Chen Lin

Chien-Yun Hsu

Sheng-Li Chang

Hsin-Yi Hsu

Yann-Cherng Chern

Kai-Yi Wu

Yang-Cheng Lin

Hung-Jen Lu

Chun-yu Lin

Yu-Yen Chang

Wen-Pin Chen

Hsuan-Ching Chao

Hua-Shan Hsu

Ming-Hsien Lee

Chi-Yi Tsai

Cheng-Pin Huang

Chi-Kang Wu

Hung-Liang Chiu

Chung-Yi Lee

Kevin Cheng

Ming-Hung Wu

Hsueh-Lei Wang

Miao-Chang Wu

Hsin-hsin Shen

Chao-Hong Hsu

Chih-Ching Liao

Chuan-Pu Chen

Ching-Chiang Chang

Cheng-Chao Tsai

Jiuen-Ying Wu

Li-hsin Lin

Chang-Hsien Chen

Yuan-Fa Lee

Kuo-Lei Ma

Min-Yu Hsieh

Shih-Yun Lin

Shi-Hui Tsai

Chueh-Shan Liu

Chung-Ping Lai

Ming-Hong Yeh

Veen Ma

Pei-Yi Kuo

Goldie Hsieh

Apparatus and methods for automatically handling die carriers are disclosed. In one example, a disclosed apparatus includes: at least one load port each configured for loading a die carrier operable to hold a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool comprises: a first robotic arm configured for transporting the die carrier from the at least one load port to the interface tool, and a second robotic arm configured for transporting the die carrier from the interface tool to the semiconductor processing unit for processing at least one die in the die carrier.

Apparatus and methods for automatically handling die carriers

The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

Systems for removing or inserting a fastener from or into a wafer carrier

A tray of an automated handling system for transporting semiconductor devices includes: a receiving region that is configured to receive a boat, the boat carrying one or more semiconductor devices thereon; and a clamping mechanism that selectively clamps the boat, residing in the receiving region, to the tray. Suitably, the clamping mechanism is automatically disengaged when the tray is positioned in a designated location and automatically engaged when the tray is not positioned in the designated location, such that, when engaged, the clamping mechanism holds the boat, residing in the boat receiving region, securely within the tray, and when disengaged, the clamping mechanism releases the boat residing in the boat receiving region.

Method and apparatus for securing semiconductor device carrying boat in multi-boat tray

A method of a handling semiconductor wafers in a space of a semiconductor wafer processing facility includes: loading a cassette containing at least one semiconductor wafer into a storage buffer of a load port; measuring, from within the storage buffer, a position of a selected at least one semiconductor wafer being retrieve from the cassette residing in the storage buffer; and determining, at least in part based on said measuring, a variation of the position of the selected semiconductor wafer from a nominal position.

Wafer alignment apparatus and method for multi-cassette load port

A transport carrier docking device may be capable of forming an air-tight seal around a transport carrier while a front portion of the transport carrier is inserted into a chamber of the transport carrier docking device. Semiconductor wafers in the transport carrier may be accessed by a transport tool while the air-tight seal exists around the transport carrier, which prevents and/or reduces the likelihood that contaminants in a semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Transport carrier docking device

A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.

Semiconductor fabrication system and method

A wafer sorting and stoking system provides automated storage and retrieval of wafer frames carrying semiconductor wafers. A wafer frame cassette is received at a transfer port from a transfer system. A robot arm retrieves the wafer frames from the cassette and stores each wafer frame in a respective storage slot in one of a plurality of storage towers. The storage location of each wafer frame is recorded. Each wafer frame can be selectively retrieved and loaded into a wafer frame cassette by the robot arm for further processing.

Wafer frame sorter and stocker

A cell and tissue sheet forming package includes a container body, a membrane, a sliding door plate and a sealing film. The sliding door plate is disposed slidably on a top of the container body to cover or expose the membrane. The sliding door plate has a hole and a passive magnetic assembly. The cell injection equipment includes a carrier, an injection mechanism and a drive mechanism. The carrier carries the package, and the drive mechanism moves the carrier and the injection mechanism to have the injection mechanism to inject a solution, through the hole, into the package. A heating element of the carrier is introduced to heat the membrane and the solution to transform the solution into a colloid sheet on the membrane. Then, the positive magnetic assembly engages magnetically the passive magnetic assembly to slide the sliding door plate to expose the colloid sheet on the membrane.

Cell and tissue sheet forming package and cell injection equipment

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Multiple semiconductor die container load port

A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Docking device with moveable frame and sealing component

The present disclosure relates to methods for inserting a fastener into a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The fastener head is received within the lower sleeve, and the screwdriver screws the fastener into the pod.

Methods for inserting a fastener into a wafer carrier

In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

Integrated semiconductor die vessel processing workstations

In some implementations, a reeling device may receive material via a receiving end of a set of guiding blocks positioned around a reel. The set of guiding blocks are configured with an opening at the receiving end and with one or more inner surfaces configured to guide the material on a path around a surface of the reel. The one or more inner surfaces of the set of guiding blocks are arc-shaped to generally follow the surface of the reel. The reeling device may operate a motor that rotates the reel in a loading direction to facilitate loading the material onto the reel. The set of guiding blocks travel generally away from the surface of the reel based on the material being received and/or the motor operating in the loading direction.

Reeling device

A system includes a loader tool to load a plate to which a sandpaper sheet is to be affixed to a surface of the plate. The system includes a sandpaper affixing tool to remove a liner from the sandpaper sheet to expose an adhesive surface of the sandpaper sheet, and to affix the sandpaper sheet to the surface of the plate using the adhesive surface of the sandpaper sheet. The system includes a flatness detector to determine whether a surface of the sandpaper sheet is sufficiently flat after the sandpaper sheet is affixed to the surface of the plate. The system includes an unloader tool to store the plate after the sandpaper sheet is affixed to the surface of the plate.

Sandpaper replacement system

Growing community of inventors

Taipei, Taiwan

Chih-Hung Huang