Everlight Electronics Co., Ltd.

Advanced Semiconductor Engineering, Inc.

Gallant Micro. Machining Co., Ltd.

Chih-Hung Hsu

Kuang-Hsiung Chen

Shih-Jen Chuang

Mei-Lin Hsieh

Yi-Cheng Hsu

Chia-Yun Hsu

Mu-Ching Chang

Ming-Jing Lee

Shang-Lin Chen

Hung-Neng Lai

Chin-Chia Hsu

Yu-Shun Hsieh

Ko-Pu Wu

Yuan-Chun Chen

Chung-Chuan Hsieh

Sheng-Jia Sheu

Yu-Ching Sun

Ren-Yi Cheng

Huan-Wen Chen

Shih-Chieh Chiu

Ying-Shih Lin

Chien-Te Chuang

Yueh-Chen Hsu

Tsai Wan

Chun-Chiang Ding

Chih-Yuan Chiang

Yi-Hu Chao

Chin Li Huang

A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

Lead frame, package structure and method for manufacturing the same

An apparatus for automated encapsulation of motor rotor core with magnet steel is introduced. The apparatus includes at least one encapsulation unit, a plastic granule feeding device, a waste removing device, a conveyance device and a control device. Under a coordinated control of the control device, a rotor core feeding mechanism of the encapsulation unit feeds rotor cores to a plastic dispensing mechanism in cycles, the plastic granule feeding device separates, outputs and dispenses plastic granules, so that they are arrayed before being dispensed onto the rotor cores, and the conveyance device conveys plastic granules and moves the waste removing device to carry waste to a waste removal zone. With these arrangements, it is able to realize automated feeding of rotor cores, automated feeding of plastic granules and automated removal of waste to achieve completely automated rotor core encapsulation operation while enables mass production of motor rotor cores.

Apparatus for automated encapsulation of motor rotor core with magnet steel

A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

An electrically-driven rotor iron core magnetic steel chamber dispensing device is introduced. Dispensing units each include a dispensing channel, dispensing head, plunger barrel, plunger and stop-injection opening pin. The dispensing channel is above the dispensing head and in communication with the dispensing head. The dispensing head is disposed at the top of the plunger barrel and in communication with the plunger barrel. The plunger is displaced in the plunger barrel to move up and down relative to the plunger barrel. The stop-injection opening pin includes a pin body disposed vertically, arranged beside the plunger barrel, and fixed to a lower mold from inside. A pin head portion is disposed at the top of the pin body. A barb is disposed between the pin head portion and the pin body. The pin head portion protrudes into the dispensing channel, allowing molten plastic in the dispensing channel to enter the barb.

Electrically-driven rotor iron core magnetic steel chamber dispensing device

An electrically-driven rotor iron core magnetic steel chamber dispensing device effectuates dispensing in the gap between a magnetic steel chamber and a magnetic steel chunk of an electrically-driven rotor iron core. The electrically-driven rotor iron core magnetic steel chamber dispensing device includes a plurality of dispensing units each corresponding in position to one or more magnetic steel chambers. The dispensing units correspond in position to the magnetic steel chamber and are arranged in the circumferential direction of the electrically-driven rotor. The dispensing units are arranged outside the magnetic steel chamber and positioned proximate to the magnetic steel chamber or is located in the direction of the projection of the magnetic steel chamber. A dispensing opening of each dispensing unit corresponds in position to the magnetic steel chamber from below. The dispensing device is structurally simple and reliable, attains cost-efficient use of plastic, and enables automated magnetic steel chamber dispensing.

A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame. The second lead frame separated from the first lead frame with a distance is connected to the LED die. The bump disposed on at least one of the first lead frame and the second lead frame to identify a gripping space for allowing an electronic element inserted or gripped therein.

Light emitting diode device for clamping electrically conductive element

A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.

Light-emitting device package structure

A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.

Light emitting diode package structure

A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Chip package structure

A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions.

Light-emitting diode structure

A method for manufacturing light-emitting diode devices. Multiple metal frames are provided. The metal frames are adjacent to each other and are arranged on a same plane. Each metal frame includes a first connection pin and a second connection pin. A light-emitting diode chip is disposed on and electrically connected to each metal frame. The metal frames are respectively bent, enabling the adjacent metal frames to separate from each other. A moldboard formed with a plurality of mold cavities is provided. The bent metal frames are respectively disposed in the mold cavities, locating each light-emitting diode chip in each mold cavity. The mold cavities are respectively filled with package gel. The package gel filled in each mold cavity covers each light-emitting diode chip. The package gel is solidified. The mold cavities are separated from the package gel. The metal frames are separated from each other, forming the light-emitting diode devices.

Method of encapsulating light-emitting diode devices using bent frames

A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.

Leadframe and chip package

An improved LED lamp manufacturing method and an improved LEP lamp device are described. In one aspect, an LEP lamp device includes an LED lamp bulb, a pair of electrical cables electrically coupled to the LED lamp bulb, and a main body. The main body encloses part of the LED lamp bulb, part of the pair of cables, a connection between the LED lamp bulb, and the pair of electrical cables. The main body includes a first plastic member and a second plastic member coupled to the first plastic member. Each of the first plastic member and second plastic member has a respective pair of cable grooves. The first plastic member or the second plastic member, or both, have one or more welding lines along an edge and between the respective pair of cable grooves.

LED lamp manufacturing method

The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased.

Growing community of inventors

Taipei County, Taiwan

Chih-Hung Hsu