Txc Corporation

Chih-Hung Chiu

Kuan-Neng Chen

Cheng-Wei Lin

Wun-Kai Wang

Jian-Yu Shih

Cheng-Hsun Chung

Min-Ho Wang

Hsiang-Jen Cheng

Chih-Hsun Chu

Chi-Chung Chang

Yen-Chih Lee

Yen-Chi Chen

A quartz oscillator including a first plate, a second plate, and a quartz sheet is provided. The quartz sheet has an oscillation zone. The quartz sheet is disposed between the first plate and the second plate. The quartz oscillator has a first outer surface, a side surface, and a first connection surface. The first outer surface is located on the first plate. The first connection surface is located between the first outer surface and the side surface. The first outer surface, the side surface, and the first connection surface are not parallel to each other. A manufacturing method of a quartz oscillator is also provided.

Quartz oscillator and manufacturing method thereof

An oscillator wafer-level-package structure is provided, comprising a bottom layer, an oscillator crystal and a capping layer. The bottom layer includes an upper plane, the capping layer includes a lower plane, and the oscillator crystal is disposed between the bottom layer and the capping layer and includes at least one cavity. An upper seal ring and a lower seal ring are respectively surrounding the oscillator crystal such that the oscillator crystal is sealed in between the capping layer and the bottom layer by employing the upper and lower seal rings. In addition, a diffusion barrier is further disposed in the upper seal ring and in the lower seal ring for avoiding interface diffusion. Moreover, the present invention adopts the same material for fabricating the capping layer, the oscillator crystal and the bottom layer to achieve an optimal thermal stress result when realizing the packaging structure.

Oscillator wafer-level-package structure

A quartz oscillating plate comprises a substrate having a notch. Two sides of the notch respectively have a first side-electrode and a second side-electrode. The first side-electrode receives an external signal. The external signal is transmitted along the perimeter of the substrate. The notch of the substrate can increase the length of the transmission path of oscillation energy. The present invention can improve the Q value of the quartz oscillator using the quartz oscillating plate and optimize the performance of the products using the quartz oscillator.

Quartz oscillating plate

The present invention provides a TSV-based oscillator WLP structure and a method for fabricating the same. The method of the present invention comprises steps: providing a silicon base having an oscillator unit disposed thereon; forming on the silicon base at least one package ring surrounding the oscillator unit; and disposing a silicon cap on the package ring to envelop the oscillator unit. The present invention adopts a cap and a base, which are made of the same material, to effectively overcome the problem of thermal stress occurring in a conventional sandwich package structure. Further, the present invention elaborately designs the wiring on the lower surface of the base to reduce the package size and decrease consumption of noble metals.

Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same

Growing community of inventors

Ping Cheng, Taiwan

Chih-Hung Chiu