Hon Hai Precision Industry Co., Ltd.

Vanguard International Semiconductor Corporation

Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.

Chih-Hsien Chen

Cheng-Fa Chung

I-Ting Huang

Yue-Han Chen

Hsin-Hui Lee

Han-Liang Tseng

Yin Jen Chen

Kwang-Ming Lin

Hsueh-Jung Lin

Jiunn-Liang Yu

Wen-Chih Lu

Si-Twan Chen

Chia-huang Chang

Ming-Chih Chiu

A backlight assembly is provided, comprising a backboard, one or more light sources, a diffuser plate, and one or more supporting assembly. The light sources are arranged on the backboard. The diffuser plate is arranged on the light-emitting side of the light source. The supporting assembly is arranged between the backboard and the diffuser plate. The supporting assembly comprises a supporting base and an elastic support. The supporting base connects with the backboard, one end of the elastic support is connected with the supporting base, another end of the elastic support supports the diffuser plate. The elastic support defines on a plurality of dimming grooves, the plurality of dimming grooves reflects at least a part of light emitted by the light source to the diffusion plate.

Backlight assembly and display device

A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Semiconductor devices and methods for forming the same

A back-light module includes a back board. The back board includes a substrate and a plurality of frame monomers. Each frame monomer comprises four lateral ribs, every two adjacent lateral ribs are perpendicularly connected with each other. The frame monomers are detachably assembled to each other to form a height adjustable back frame, and the height adjustable back frame is assembled with the substrate to form a height adjustable light-mixing chamber.

Back-light module with interassembled set of frames and height adjustable back frame forming light-mixing chamber

A liquid crystal display device thermally insulated from light source heat, includes a display panel, a backlight module positioned on the display panel, a bezel positioned around the backlight module, and a thermal insulating element mounted on the bezel. The backlight module includes a light guiding plate and at least one light source located at a side of the light guiding plate. The thermal insulating element is positioned between the at least one light source and the bezel. A sealed space is formed between the thermal insulating element and the bezel. The thermal insulating element and the sealed vacuum space are configured to thermally insulate heat generated by the at least one light source and prevent heat from transferring to the bezel and display panel.

Liquid crystal display device thermally protected against internal light source

A backlight module includes a light guiding plate having a side surface, at least one light source facing towards the light guiding plate, and a thermal insulation element. The thermal insulation element is configured to prevent heat from the at least one light source from transferring to the bezel and display panel. The thermal insulation element is coupled to the side surface. The at least one light source is enclosed by the light guiding plate and the thermal insulation element.

Backlight module and liquid crystal display device using same

Growing community of inventors

Taipei, Taiwan

Chih-Hsien Chen