United Microelectronics Corp.

Chih-Hsiang Shiau

Yi-Ching Wu

Jiann-Fu Chen

A semiconductor structure and a method of fabrication there-for are provided. The semiconductor structure comprises a substrate, a dielectric layer disposed over the substrate, a hydrophilic material layer disposed over the dielectric layer, and a hardmask layer disposed over the hydrophilic material layer. It is noted that, the edge of the semiconductor structure may be polished after the hydrophilic material layer is formed over the dielectric layer and before the hardmask layer is formed over the hydrophilic material layer.

Growing community of inventors

Hsinchu, Taiwan

Chih-Hsiang Shiau