Industrial Technology Research Institute

Wistron Neweb Corporation

Chih-Hsiang Liu

Chung-Lun Kuo

Hsiang-Chun Wei

Chun-Wei Lo

Yan-Rung Lin

Chia-Hung Cho

Tsun-Che Huang

Yi-Sha Ku

Shie-Chang Jeng

Chieh-Yi Lo

Horen Chen

Kai-Ping Chuang

Fu-Cheng Yang

Po-Yi Chang

Wei-Tung Yang

Wei-Hsiung Tsai

Yeou-Sung Lin

Chieh-Yu Wu

A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.

Measurement system and measurement method

A method for inspecting LED dies includes the following steps. First electrodes and second electrodes of LED dies to be inspected are short-circuited via a conductive layer on an inspection substrate, or an inspection bias voltage is applied between the first electrodes and the second electrodes of the LED dies. An excitation light is irradiated on the LED dies to be inspected on the inspection substrate such that the LED dies to be inspected emit a secondary light. When the first electrodes and the second electrodes of the LED dies to be inspected are open, short-circuited, and/or subjected to the inspection bias voltage, the secondary light is captured via an optical sensor. An output of the optical sensor is received via a computer and a spectrum difference of the secondary light is calculated to determine whether the LED dies are abnormal or to classify the LED dies to be inspected.

Apparatus and method for inspecting light-emitting diode dies

A method of training AI for label-free cell viability determination includes a step of providing a cell sample, a step of obtaining a fluorescence image and a DHM image of the cell sample, a step of determining a first cell viability of the cell sample according to the fluorescence image of the cell sample, a step of labeling the DHM image of the cell sample as a model specifying the first cell viability, and a step of performing AI training by using the model containing the DHM image of the cell sample.

Method of training AI for label-free cell viability determination and label-free cell viability determination method by trained AI

A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

Heterogeneous integration detecting method and heterogeneous integration detecting apparatus

An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.

Antenna module and wireless transceiver device

An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.

Inspection apparatus and inspection method for inspecting light-emitting diodes

An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.

Optical measurement system for obtaining and analyzing surface topography of object

An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

Method for inspecting light-emitting diodes and inspection apparatus

A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

Three-dimension measurement device and operation method thereof

A method for inspecting light-emitting diodes (LEDs) including following steps is provided. A plurality of LEDs are provided. A charge distribution, an electrical field distribution, or a voltage distribution on the LEDs that are irradiated by an illumination beam at the same time are inspected by a sensing probe, so as to determine electro-optical characteristics of the LEDs. Besides, an inspection apparatus is also provided.

A repeater includes an up-link circuit and a down-link circuit. The down-link circuit includes a receiver, a radio frequency circuit and a transmitter. The transmitter transmits the repeated second signals to the user equipment and includes an antenna array, a plurality of power amplifiers, a plurality of first phase shifters, a first memory unit, and a first control logic circuit. The antenna array includes a plurality of antenna elements arranged along a first direction, and the number of the plurality of antenna elements is at least four. The first memory unit is configured to store predetermined parameters associated with a predetermined radiation pattern. The first control logic circuit selects a first number of the power amplifiers and the first number of the first phase shifters, and sets normalized gains for the selected plurality of power amplifiers range from 0.7 to 1 unit.

Repeater and radiation pattern forming method for the same

An antenna structure includes a holder and a first antenna assembly. The holder includes a first board, a second board, a third board, and a fourth board. The first board, the second board, the third board, and the fourth board are connected to each other to surround a surrounding space. The first antenna assembly includes a first antenna body and a second antenna body. The first antenna body and the second antenna body are disposed in the surrounding space. The first antenna body and the second antenna body respectively include a feeding portion, a conjoining portion, and a ground portion. The ground portion of the first antenna body is connected to the first board. The ground portion of the second antenna body is connected to the second board.

Antenna system and antenna structure thereof

A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.

Growing community of inventors

Hsinchu, Taiwan

Chih-Hsiang Liu