Integrated Device Technology, Inc.

Qualcomm Incorporated

Chih-Hsiang Ko

Tumay Kanar

Seong Heon Jeong

Samet Zihir

Randy Standke

An apparatus includes a package and a beam former circuit. The package may be configured to be mounted on an antenna array at a center of four antenna elements. The beam former circuit may (i) be disposed in the package, (ii) have a plurality of ports, (iii) be configured to generate a plurality of radio-frequency signals in the ports while in a transmit mode and (iv) be configured to receive the radio-frequency signals at the ports while in a receive mode. A plurality of ground bumps may be disposed between the beam former circuit and the package. The ground bumps may be positioned to bracket each port. Each ground bump may be electrically connected to a signal ground to create a radio-frequency shielding between neighboring ports.

Radio-frequency signal shielding and channel isolation

An apparatus comprises a phased array antenna panel, a plurality of amplifier circuits, and a plurality of beamformer circuits. The phased array antenna panel generally comprises a plurality of antenna elements. Each of the amplifier circuits is mounted on the phased array antenna panel adjacent to a respective one of the plurality of antenna elements and each of the amplifier circuits has one or more first ports directly coupled to the respective antenna element. Each of the beamformer circuits is mounted on the phased array antenna panel adjacent to a number of the amplifier circuits. Each of the beamformer circuits has one or more second ports directly coupled to each of the adjacent amplifier circuits. Each of the beamformer circuits is generally configured to exchange a plurality of radio-frequency signals with each of the adjacent amplifier circuits via the second ports.

Beam forming module implementation for high isolation and low noise figure systems

Disclosed is a wireless power transfer apparatus that includes a case for an electronic device. The case may have an electrically conductive panel portion and side portions defined along sides of the panel portion. The case further have at least one opening formed one of the side portions. A coil configured to couple to an externally generated magnetic field may have first segments that span a width of the panel portion of the case and second segments arranged along the side portions of the case and exposed through the at least one opening.

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San Diego, CA, United States of America

Chih-Hsiang Ko