Advanced Semiconductor Engineering, Inc.

National Yang Ming Chiao Tung University

Chih-Hsiang Hsu

Yu-Ting Lu

Che-Ting Liu

Po-Chun Lee

Jheng-Yu Hong

Chen-Yi Lee

Hsie-Chia Chang

Shih-Kuang Chen

Yi-Min Lin

A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).

Method and system for manufacturing a semiconductor package structure

In a cyclic code decoding method, a decoder analyzes a received codeword to identify unreliable symbols in the codeword, and sets candidate syndrome patterns accordingly. Then, a syndrome calculator calculates evaluated syndrome values associated with one of the candidate syndrome patterns, and an error location polynomial (ELP) generator generates an ELP according to the syndrome values. An error correction device corrects the errors in the codeword according to the ELP when a degree of the ELP is not more than a threshold value, and the syndrome calculator adjusts the syndrome values and the ELP generator generates another ELP according to the adjusted syndrome values when otherwise.

Cyclic code decoding method and cyclic code decoder

In a method for manufacturing an under-bump metallurgy (UBM) layer, a plate having a plurality of openings is prepared. Then, the plate is placed on the wafer. Finally, the material of the under-bump metallurgy layer is sputtered on the wafer using the plate as a sputter mask so as to quickly form the under-bump metallurgy layer.

Method for manufacturing an under-bump metallurgy layer

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Kaohsiung, Taiwan

Chih-Hsiang Hsu