United Microelectronics Corp.

Chih-Ho Wang

Shui-Yen Lu

Shih-Chieh Hsu

Chi-Horn Pai

Shao-Hua Hsu

Jhen-Cyuan Li

Zen-Jay Tsai

Hung-Yi Wu

Ying-Hung Chou

Shih-Hao Su

A method of forming a semiconductor device includes the following steps. At least a fin structure is provided on a substrate and a gate structure partially overlapping the fin structure is formed. Then, a dielectric layer is formed on the substrate. Subsequently, a first etching process is performed to remove apart of the dielectric layer to form a first spacer surrounding the gate structure and a second spacer surrounding a sidewall of the fin structure, and a protective layer is formed in-situ to cover the gate structure and the first spacer. Finally, a second etching process is performed to remove a part of the protective layer and totally remove the second spacer.

Method of forming semiconductor device

A semiconductor process is provided. The prior steps include: a first gate including a first cap layer and a second gate including a second cap layer are formed on a substrate. A hard mask layer is formed to cover the first gate and the second gate. The material of the hard mask layer is different from the material of the first cap layer and the second cap layer. The hard mask layer is removed entirely after a lithography process and an etching process are performed. The following steps include: a material is formed to entirely cover the first gate and the second gate. The material, the first gate and the second gate are etched back to make the first gate and the second gate have the same level and expose layers in both of them.

Semiconductor process

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Tainan, Taiwan

Chih-Ho Wang