Lextar Electronics Corporation

Foxconn Precision Components Co., Ltd.

Sinotech Engineering Consultants, Inc.

Chih-Hao Yang

Kuo-Lung Fang

Jun-Rong Chen

Cheng-Hsien Tsai

Chi-Wen Kuo

Timin Zhang

Fu-Yuan Hsiao

Shu-Yung Chi

Shih-Hui Wang

The present invention discloses a method of infrared spectrometric measurement of tunnel gas employing a gas measurement system including a gas collection unit, a gas analysis unit and a positioning indication unit for measuring the gas in the tunnel. The method performs sequential steps of installing the gas measurement system, starting the positioning indication unit for positioning one of the detection regions in the tunnel space, sampling the gas in the detection region through the gas collection unit, analyzing the gas by the gas analysis unit, generating a gas analysis result, and determining whether all of the detection regions are completed. With the newly designed gas collection unit in collocation with the gas analysis unit and the positioning indication unit, the method of the present invention does not only fast install the whole gas measurement system, but also well understands all preliminary information related to the harmful gas in the tunnel like sort and concentration, thereby instantly taking correct measures.

Method of infrared spectrometric measurement of tunnel gas

A method for fabricating a light-emitting device is provided. The method includes: providing a substrate; forming a sacrificial dielectric layer on the substrate, wherein the sacrificial dielectric layer is a structure containing voids; forming a buffer layer on the sacrificial dielectric layer; forming an epitaxial light-emitting structure on the buffer layer; forming a metal bonding layer on the epitaxial light-emitting structure; bonding the metal bonding layer to a thermally conductive substrate; and wet etching the sacrificial dielectric layer for to remove the substrate.

Light-emitting semiconductor structure and method for fabricating light-emitting diode device

A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.

Carrier structure and manufacturing method thereof

A liquid cooler ( ) includes a body ( ) and a cover ( ) attached on the body. The body includes a base ( ) with a first cavity ( ) accommodating liquid, a central hollow cylinder ( ) having a passage ( ) in communication with the first cavity, and a plurality of vertical tubes ( ) in communication with the first cavity. A plurality of fins ( ) extends outwardly from the hollow cylinder. The cover defines a second cavity ( ) in communication with the passage and the tubes. The liquid within the first cavity is heated by a heat-generating electronic device and moved to the second cavity through the tubes. Heated liquid which has reached the second cavity flows down through the passage along an inner surface of the hollow cylinder and returns back to the first cavity. The heated liquid is cooled by the fins conducting heat away from the hollow cylinder.

Liquid circulation cooler

Growing community of inventors

Taipei, Taiwan

Chih-Hao Yang