Lextar Electronics Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

National Taiwan University

Novatek Microelectronics Corp.

Lite-on Technology Corporation

Altek Corporation

Chih-Hao Lin

Jo-Hsiang Chen

Jian-Chin Liang

Chien-Kuo Chang

Shih-Lun Lai

Tzong-Liang Tsai

Chi-Yang Yu

Chien-Nan Yeh

Tzu-Kai Lan

Min-Che Tsai

Kuan-Lin Ho

Shiou-Yi Kuo

Hsin-Lun Su

Chung-Chih Chen

Yi-Jyun Chen

Jr-Lin Hsu

Tai-I Yang

Jung Wei Cheng

Yu-Chun Lee

Hong-Seng Shue

Po-Chang Chen

Ruei-Hung Jang

Hui-Ru Wu

Chang-Han Chen

Kuang-Neng Yang

Kun-Hua Wu

Chun-Peng Lin

Bu-Fang Chen

Che-Hsuan Huang

Shu-Hsiu Chang

Fang-Chang Hsueh

Jhih-Siou Cheng

Yi-Cheng Lin

Yu-Chih Liu

Fu-Hsin Chen

Wei-Chih Lin

Chun-Yi Yang

Fu-Jen Li

Chieh-An Lin

Cheng-Ta Kuo

Ai-Sen Liu

Yu-Min Lin

Hsien-Liang Meng

Jing Ruei Lu

Li-Cheng Yang

Chih-Wen Lu

Yu-Jen Huang

Cheng-Te Lin

Hui-Ting Lin

Chuan Lee

Chen-I Kuo

Tung-Li Lee

Ku-Cheng Lin

Fu-Ji Tsai

Yao-Hui Huang

Yen-Fei Lin

Fei-Wen Cheng

Chi-Feng Chiang

James Sun

Chen Pu-Fang

David Huang

Song-Fu Chen

Xi-Sheng Zhuang

Jung Tsung Cheng

Wei-Yuan Ma

Tai-Hua Ho

Chun-Min Lin

Marcus Yang

Liang-Tang Chen

Wen-Chun Hsu

Pu-Sheng Lee

Cheng-Wei Hung

Chao-Hsien Wang

Chih-Ping Lo

Chia-Ching Tso

A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

Light emitting diode device

The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.

Light emitting diode packaging structure

A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

Light emitting element package including substrate with edge notch and display device including light emitting element package

Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first and second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

Light emitting array structure and display

A display device includes a plurality of sub-pixels. The sub-pixels include a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light emitting element and a first control circuit. The first control circuit is configured to provide a first driving current to the first light emitting element. The second sub-pixel includes a second light emitting element and a second control circuit. The second control circuit is configured to provide a second driving current to the second light emitting element. The first control circuit and the second control circuit are configured to differently control pulse amplitude of the first driving current and pulse amplitude of the second driving current, such that both of the first light emitting element and the second light emitting element emit at a target wavelength or a color point range (e.g. +/−1.5˜2 nm).

Display device and driving method thereof

The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.

Semiconductor package having varying conductive pad sizes

A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

Method for manufacturing light emitting diode packaging structure

A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

Light emitting device, package device and method of light emitting device manufacturing

Disclosed is a light-emitting array structure having a substrate, a plurality of light-emitting pixel units, a plurality of first signal wires, a plurality of second signal wires, and an encapsulating layer. The light-emitting pixel units are arranged in array on the substrate. Each light-emitting pixel unit includes a driving chip, a first flat layer, a first redistribution layer, a second flat layer, a second redistribution layer, and a light-emitting diode. Each first signal wire is electrically connected to a corresponding one of the first redistribution layers and extends in a first direction. The second signal wires extend in a level different from the first signal wires. Each second signal wire is electrically connected to a corresponding one of the second redistribution layers and extends in a second direction different from the first direction. The encapsulating layer covers the light-emitting pixel units, the first and second signal wires, and the substrate.

A light emitting device includes an LED die and a wavelength conversion layer. The LED die has a light emitting top surface and light emitting side surfaces. The wavelength conversion layer contains quantum dots and a photosensitive material, and is located on the light emitting top surface. A light emitting module including multiple light emitting devices is also disclosed.

Light emitting device and module

The display device includes a substrate, a patterned wall, the first, second, third sub-pixels, and an optical layer. The patterned wall is disposed on the substrate and has a plurality of openings. The first sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The second sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer. The third sub-pixel is disposed in one of the openings and includes a light-emitting element and a wavelength conversion layer, wherein a first distance between a top surface of the light-emitting element and a top surface of the patterned wall is about 10 um to about 100 um. The optical layer is disposed on the patterned wall and in direct contact with at least one of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

Display device

A display includes first and second pixel devices. The first pixel device includes a first control circuit and a first light emitting circuit. The first control circuit generates a first light emitting signal according to a first clock signal and a data signal during a first period. The first light emitting circuit emits light according to the first light emitting signal during second and third periods. The second pixel device includes a second control circuit and a second light emitting circuit. The second control circuit generates a second light emitting signal according to a second clock signal and the data signal during the second period. The second light emitting circuit is coupled to the second control circuit and emits light according to the second light emitting signal during the third period. The first period to the third period are arranged continuously in order.

Display with pixel devices emitting light simultaneously

A light-emitting device includes a panel substrate, a light-emitting chip, and a light extracting layer. The light-emitting chip is disposed on the panel substrate. The light extracting layer covers the light-emitting chip and the panel substrate, and the light extracting layer has a side portion. Taking the position where the edge of the light-emitting chip is in contact with the panel substrate as the origin, the side portion and the origin define a circle tangential to the surface of the side portion. The circle has a radius c which satisfies the following formula (1): 

Light-emitting device

Growing community of inventors

Hsinchu, Taiwan

Chih-Hao Lin