Industrial Technology Research Institute

National Cheng-kung University

Chih-Hao Hsu

Rong Xuan

Jenq-Dar Tsay

Yi-Ming Chen

Wen-Yung Yeh

Chia-Jung Chang

Jing-Yuan Lin

Chen-Peng Hsu

Chao-Wei Li

Chen-Kun Chen

Mu-Tao Chu

Cheng-Da Shaw

Chiung-Hung Wang

Yuan-Jen Chang

Hsueh-Chih Chang

Yu-Hsiang Chang

Kun-Fong Lin

Jui-Hung Tsai

Chia-Hung Chiu

Chi-Lun Hsu

Jung-Chun Huang

Chun-Ying Chen

Jeng-Dar Tsay

Ming-Fa Huang

Provided is a residual toxicant detection system and a residual toxicant detection method, the residual toxicant detection method including: allowing an aqueous solution containing a residual toxicant to flow into a detection portion including a cavity; providing at a side of the cavity a light containing a specific wavelength range to react with the residual toxicant; receiving the light that passes through the cavity on another side of the cavity, thereby generating a sensing signal; and calculating an amount of change in absorbance of the aqueous solution according to the sensing signal, wherein when the amount of change in absorbance is less than a threshold value, a detection count is accumulated, and when the accumulated detection count is greater than a predetermined value, a detection result is generated. Therefore, whether or not the residual toxicant on the object is cleaned can be determined easily and accurately.

Residual toxicant detection system and residual toxicant detection method

A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

Light emitting chip package module and light emitting chip package structure and manufacturing method thereof

A nitride semiconductor light emitting device including an n-type nitride semiconductor layer, a p-type nitride semiconductor layer, a light emitting semiconductor layer, a first metal pad, a second metal pad, and a first magnetic material layer is provided. The light emitting semiconductor layer is disposed between the n-type nitride semiconductor layer and the p-type nitride semiconductor layer. The first metal pad is electrically connected to the n-type nitride semiconductor layer. The second metal pad is electrically connected to the p-type nitride semiconductor layer. The first magnetic material layer is disposed between the first metal pad and the n-type nitride semiconductor layer. A distribution area of the first magnetic material layer parallel to a (0001) plane of the n-type nitride semiconductor layer is greater than or equal to an area of the first metal pad parallel to the (0001) plane.

Nitride semiconductor light emitting device with magnetic film

A light emitting device including a light emitting chip and a magnetic material is provided. The light emitting chip includes a first doped semiconductor layer, a second doped semiconductor layer, and a light emitting semiconductor layer disposed between the first doped semiconductor layer and the second doped semiconductor layer. The magnetic material is disposed beside the light emitting chip, wherein the magnetic material is not disposed on a conducting path of a current causing the light emitting chip to emit light.

Light emitting device

A light emitting device package including a light emitting device and a magnetic ring is provided. The magnetic ring surrounds the light emitting device for forming a magnetic source for applying a magnetic field to the light emitting device.

Light emitting device package

A light emitting device with magnetic field includes a light-emitting structure and a first magnetic-source layer. The light-emitting structure includes a first doped structural layer, a second doped structural layer, an active layer between the two doped structural layers, a first electrode, and a second electrode. The first magnetic-source layer is integrated with the light-emitting structure to produce a magnetic field in the light-emitting structure. The magnetic field transversely shifts a driving current of the light-emitting structure to redistribute in the light-emitting structure.

Light emitting device with magnetic field

A light emitting device is provided. In the present invention, a magnetic material is added to the light emitting device to change the current path and the distribution of the current density. As the main distribution of the current density is moved from the area between the electrodes to the area under light-out plane, the emitted light is no longer blocked by the electrodes, such that the light emitting efficiency can be enhanced and the distribution of the current density remains homogeneous.

A light emitting device with magnetic field includes a light emitting device, a thermal conductive material layer and a magnetic layer. The thermal conductive material layer is coupled with the light emitting device to dissipate heat generated by the light emitting device. The magnetic layer is coupled with thermal conductive material layer to produce a magnetic filed on the light emitting device.

A light-emitting device with magnetic-source includes a light emitting stack structure. The light emitting stack structure has a first electrode and a second electrode distributed at a light output side of the light emitting stack structure. A magnetic-source layer is engaged with the light emitting stack structure to provide a magnetic field to the light emitting stack structure in a substantially perpendicular direction to the light emitting stack structure. Alternatively, a method for improving light emitting performance of a light-emitting device includes applying a magnetic field to the light-emitting device at a direction substantially perpendicular to a light emitting area of the light-emitting device.

Light-emitting device with magnetic field

A light emitting device package including an light emitting device and at least one magnetic source is provided. The light emitting device includes a first doped type layer, a second doped type layer, and a light emitting layer. The light emitting layer is located between the first doped type layer and the second doped type layer. The magnetic source is disposed beside the light emitting device for applying a magnetic field to the light emitting device.

An optical transceiver module includes a plurality of optical signal transmission/receiving units to receive and transmit optical signals, and is fastened to a base by a fastening unit. Each optical signal transmission/receiving unit includes a heat sink to promote heat dissipation efficiency. An electromagnetic shielding part covers the optical receiver to isolate from electromagnetic interference. A guiding plate is provided in the module to comb terminals of the module when the low-density wavelength-multiplex transceiver module is to be placed in an electronic device.

Growing community of inventors

Hsinchu, Taiwan

Chih-Hao Hsu