United Microelectronics Corp.

Chih-Hao Cheng

Yen-Chuan Chen

Tien-Shang Kuo

Yung-Tai Hsu

An integrated circuit includes a scribe line, a bonding pad structure and an extension pad structure. The scribe line is disposed on a substrate, and the bonding pad structure and the extension pad structure are both disposed in a dielectric layer on the substrate. The bonding pad structure includes first vias disposed on first metal layers in the dielectric layer. The extension pad structure includes second metal layers and a number of the second metal layer is less than that of the first metal layers. Also, the bonding pad structure has a first region and a second region, and second vias is disposed on the second metal layers in the first region and no vias is disposed on the second metal layers in the second region.

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Hsinchu, Taiwan

Chih-Hao Cheng