Nan Ya Technology Corporation

Chih-Han Chang

Chang-Rong Wu

Hsin-Jung Ho

Hsin-Chuan Tsai

Li-Wu Tsao

Chien-Jung Sun

A method for forming a deep trench capacitor buried plate. A substrate having a pad oxide and a pad nitride is provided. A deep trench is formed in the substrate. A doped silicate film is deposited on a sidewall of the deep trench. A sacrificial layer is deposited in the deep trench, and etched back to expose parts of the doped silicate film. Then, an etching process is performed to remove the exposed doped silicate film and parts of the pad oxide for forming a recess. The sacrificial layer is removed. A silicon nitride layer is deposited to fill the recess and to cover the doped silicate film. Finally, a thermal oxidation process is performed to form a doped ion region. The silicon nitride layer is removed. The doped silicate film is removed.

Method for forming a deep trench capacitor buried plate

A method of fabricating a capacitor of a DRAM cell. First, an insulating layer is formed on the semiconductor substrate at the top portion of the trench. Afterward, a seed layer on the ringed insulating layer and the semiconductor substrate at the bottom portion of the trench. A photoresist is coated in the trench at the bottom portion. Next, the seed layer is partially removed to expose the ringed insulating layer while the photoresist is used as the shield. The photoresist is then removed to expose the remaining seed layer at the bottom portion. A hemispherical silicon grain layer is deposited from the remaining seed layer on the semiconductor substrate. Ions are doped the hemispherical silicon grain layer and the semiconductor substrate so as to create a doped area to serve as the lower electrode of the capacitor.

Method of fabricating a DRAM cell capacitor

This invention relates to a dual damascene process with porous low-k dielectric material. A first insulating layer is formed on a porous low-k dielectric layer. The first insulating layer has a first pattern for defining a first opening in the low-k dielectric layer. Also, the invention includes the step of forming a second insulating layer on the first insulating layer. Both the first insulating layer and the second insulating layer are used as a hard mask, the two insulating layers being of different materials. The second insulating layer has a second pattern for defining a second opening in the low-k dielectric layer. Then, at least one etch is performed to form a dual damascene structure in the porous low-k dielectric layer by the different insulating layers which cause different protection time in etching the porous low-k dielectric layer.

Growing community of inventors

Taipei Hsien, Taiwan

Chih-Han Chang