Industrial Technology Research Institute

Molex Corporation

Xilinx, Inc.

Chih-Chung Wu

Zuon-Min Chuang

Mohsen Hossein Mardi

Xin X Wu

Hassan K Bazargan

Chih-Chung Hsu

Jae Cho

Hsuan-Fu Wang

Yu Hao Huang

Sanjiv Stokes

Kuo-Ding Shin

Shih-Hong Chang

Shih-Liang Liang

Kai-Wen Cheng

Bing-joe Hwang

Feng-Hsiang Lo

Chih-Lung Lin

Bing Joe Hwang

Chao-Lin Su

Yong-Long Lee

Chih-wei Peng

Chin-Shou Huang

Shin-Huei Wu

Chiou Yen Chiou

Shin-Bo Wang

Li-Chi Yang

Bing-Hao Shih

The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Package structure having photonic integrated circuit

The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver. The interleaver further transfers the second optical signals to the different connection ports according to the different wavelengths of the second optical signals.

Photonic integrated circuit chip

A method for fabricating an IBIIIAVIA-group amorphous compound used for thin-film solar cells is provided. A mixture solution including elements of Group IB, IIIA, VIA or combinations thereof is provided. The mixture solution is heated and filtered. IBIIIAVIA-group amorphous powders are acquired after drying the heated and filtered mixture solution.

Fabrication method for ibiiiavia-group amorphous compound and ibiiiavia-group amorphous precursor for thin-film solar cells

Fabrication methods for nano-scale chalcopyritic powders and polymeric thin-film solar cells are presented. The fabrication method for nano-scale chalcopyritic powders includes providing a solution consisting of group IB, IIIA, VIA elements on the chemistry periodic table or combinations thereof. The solution is heated by a microwave generator. The solution is washed and filtered by a washing agent. The solution is subsequently dried, thereby acquiring nano-scale chalcopyritic powders.

Fabrication methods for nano-scale chalcopyritic powders and polymeric thin-film solar cells

A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.

Semiconductor component having test pads and method and apparatus for testing same

An automatic detecting device of land pre-pits signal is disclosed. The device adjusts gain of push-pull signals to raise the signal to noise ratio of the land pre-pits signal to the wobble signal. Digital logic computation is also utilized to recognize the practical position of the land pre-pits. The level automatic detection of the RC circuit and the fixed slice level compose an automatic slice level, which is the basis for detecting the land pre-pits. The disclosed device eliminates the drawback of not easy to obtain correct land pre-pits signal from written disks by the conventional of fixed land pre-pits slice level technology.

Automatic detecting device for land pre-pits signals

The invention provides a method for adjusting a speed-detection device for an object lens in an optical pickup head. The invention provides an adjusted optical disc drive, wherein the optical pickup head is accelerated/decelerated and the speed-detection device outputs a standard signal level. Next, the optical pickup head of an unadjusted optical disc drive is accelerated/decelerated under the same condition, and the speed-detection device outputs a speed signal level. Finally, the gain of a programmable gain amplifier is adjusted until the speed signal is equal to the standard signal.

Method for adjusting a speed-detection device for an object lens in an optical pickup head

Growing community of inventors

Hsinchu, Taiwan

Chih-Chung Wu