Coretech System Co., Ltd.

Molex Corporation

Coretech Systems Co., Ltd.

Chih-Chung Hsu

Rong-Yeu Chang

Chia-Hsiang Hsu

Li-Hsuan Shen

Zuon-Min Chuang

Chih-Chung Wu

Chia-Peng Sun

Chien-Ting Wu

Ching-Kai Chou

Chen-Chieh Wang

Wei-Yu Lin

Hsun Yang

Chih-wei Peng

Kai-Yi Bai

Chi-Hua Yu

Guo-Sian Cyue

Hsien-Sen Chiu

Yi-Wen Chen

Mao-ken Hsu

Tung-Huan Su

Yu-Ho Wen

Yu-En Liang

You-Sheng Zhou

The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Package structure having photonic integrated circuit

The present disclosure provides a molding system for fabricating a FRP composite article. The molding system includes a detector, a resin dispenser, a processing module, and a molding machine. The detector is configured to capture a graph of a woven fiber from a top view. The resin dispenser is configured to provide a resin to the woven fiber to form a FRP. The processing module is configured to receive the graph and a plurality of parameters of the FRP. The processing module includes a CNN model, and is configured to use the CNN model to obtain a plurality of predicted mechanical properties of the FRP according to the graph and the plurality of parameters of the FRP. The molding machine is configured to mold the FRP to fabricate the FRP composite article according to the plurality of predicted mechanical properties.

Molding system for fabricating fiber reinforcement polymer composite article and molding method thereof

The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.

Method of mesh generation for resin transfer molding process

The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.

Method of measuring voids in underfill package

The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.

Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same

The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.

Method of measuring underfill profile of underfill cavity having solder bumps

A computer-implemented simulation method for use in a molding process by a computer process is disclosed. The method includes steps of specifying a simulating domain comprising a mold cavity and a barrel of an injection machine, wherein the barrel is configured to connect to the mold cavity; creating at least one mesh by dividing at least part of the simulating domain; specifying boundary conditions of the mesh by taking into consideration at least one motion of a screw in the barrel; and simulating a first injection-molding process of a molding material by using the boundary conditions to generate a plurality of molding conditions.

Computer-implemented simulation method for injection-molding process

A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.

Molding system for preparing an in-mold decorated article

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Zhubei, Taiwan

Chih-Chung Hsu