Wistron Neweb Corporation

Chih-Chuan Lin

Chien-Ming Peng

Yan-Da Chen

Chi-Te Lin

Yu-Jen Liu

An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Electronic device and heat dissipating electromagnetic shielding structure

A wireless communication device includes a base, a first antenna module, and a second antenna module. The base has a first bearing surface and a second bearing surface disposed opposite to the first bearing surface. The first antenna module is disposed on the first bearing surface. The second antenna module is disposed on the second bearing surface. Upon the structure of the wireless communication device, the dissipation efficiency and signal transmission/reception performance generated by the antenna of the wireless communication device can be improved.

Growing community of inventors

Hsinchu, Taiwan

Chih-Chuan Lin