Other

United Microelectronics Corp.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

Chih-Chiang Yang

Juan-Yuan Wu

Kun-Lin Wu

Chien-Hsin Lai

Peng-Yih Peng

Juen-Kuen Lin

Hao-Kuang Chiu

Daniel Chiu

Ming-Tzung Hsu

Yu-Chia Chang

Po-Lin Wei

Pei Wei Yeh

Paul Tan

Chung-I Cheng

Yung-Tai Tseng

Pi-Ming Lee

Jain-Li Wu

Ying-Lang Chuang

Jarvis Wang

Disclosed is a data transfer system capable of accelerating data transmission between two chips. The data transfer system includes: a master system-on-a-chip (SoC) including a master transmission circular buffer and a master reception circular buffer; and a slave SoC including a slave reception circular buffer and a slave transmission circular buffer. The slave/master reception circular buffer is a duplicate of the master/slave transmission circular buffer; accordingly, the write pointers of the two corresponding buffers are substantially synchronous and the read pointers of the two corresponding buffers are substantially synchronous as well. In light of the above, the read and write operations of the master/slave transmission circular buffer can be treated as the read and write operations of the slave/master reception circular buffer; therefore some conventional data reproducing procedure(s) for the data transmission can be omitted and the data transmission is accelerated.

Data transfer system, circuit, and method

A slurry supply system with multiple supply modules and a flushing module concurrently coupled to the multiple supply modules is provided. Each supply module includes a slurry reservoir and at least one delivery line connecting to the slurry reservoir, wherein each delivery line is oriented toward a chemical mechanical polishing apparatus. The flushing module includes a flushing liquid reservoir and multiple flushing lines connecting to the flushing liquid reservoir, wherein each flushing line is coupled to each delivery line thereby the flush module can selectively flush one of the delivery lines.

Slurry supply system

An electrodeless lamp protecting device installed between an electrodeless lamp and a power source comprises a substrate having a feedback signal input module, a signal level determination module and a protection signal output module installed on the substrate. A signal of the power source is transmitted from the feedback signal input module to the signal level determination module, and the signal serves as a reference for an output signal of the protection signal output module, such that the electrodeless lamp has an automatic protection function upon the receipt of an abnormal signal.

Electrodeless lamp protecting device

An optical data recording method for a disk drive having a plurality of rotation speeds. First, a plurality of write strategies corresponding to different possible rotation speeds of the disk drive is provided. Next, the practical rotation speed of the disk drive is detected. Next, the write strategy is selected according to the detected rotation speed of the disk drive. Next, optical data is written to an optical disc with the selected write strategy. Finally, the practical rotation speed of the disk drive is continuously detected during writing of optical data, and optical data is written to the optical disc with different write strategy when the practical rotation speed of the disk drive is changed to correspond to different write strategy.

Dynamically selecting write strategy for writing data to an optical disc

A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Chemical-mechanical polish machines and fabrication process using the same

Chemical mechanical polish machines and fabrication process using the same

The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.

Method and apparatus for preventing particle contamination in a polishing machine

Growing community of inventors

Hsinchu, Taiwan

Chih-Chiang Yang