Formfactor, Inc.

Chih-Chiang Tseng

Gary W Grube

Benjamin N Eldridge

Igor Y Khandros

Gaetan L Mathieu

Charles A Miller

Benjamin N Eldridge, Jr

Poya Lotfizadeh

Roy John Henson

Matthew E Chraft

Igor K Khandros

A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Multilayered probe card

Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.

High performance probe system

Method of manufacturing a probe card

Growing community of inventors

Dublin, CA, United States of America

Chih-Chiang Tseng