Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

Lite-on Electronics (guangzhou) Limited

Lite-on Electronics Corporation

Chih-Chiang Kao

Chen-Hsiu Lin

Hung-Yuan Su

Jia-Min Shieh

Po-Wei Li

Chia-Hao Wu

Chih-Lung Liang

Wen-Hsiang Lin

Hsiu-Tsu Wang

Tzeng-Guang Tsai

Tseng-Guang Tsai

A luminaire is provided, which includes a first light source for providing an illumination light and a second light source passing through at least one image pattern for providing a patterned light. The first light source and the second light source are coupled to a driving circuit and covered by a lamp cover. The driving circuit is used to selectively drive at least one of the first light source and the second light source for providing the illumination light and/or the patterned light. A user may turn on or switch different patterns by touching a casing of the luminaire.

Luminaire

A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.

Light emitting diode chip, and methods for manufacturing and packaging the same

A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.

Package structure and LED package structure

A current regulating circuit is for connection in series between a light emitting diode (LED) and a power source, and includes: a first resistive unit having a first resistance that is proportional to an operation temperature of the LED when the operation temperature is above a predetermined threshold temperature; and a second resistive unit connected in series with said first resistive unit, and having a second resistance that is inversely proportional to the operation temperature of the LED when the operation temperature is above the predetermined threshold temperature. When the operation temperature of the LED is above the predetermined threshold temperature, an effective resistance of said current regulating circuit attributed to said first and second resistive units is proportional to the operation temperature of the LED, and absolute value of a rate of change of the first resistance is larger than that of the second resistance.

Current regulating circuit and light emitting diode device having the same

A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.

Light emitting diode device

A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof.

Growing community of inventors

Kaohsiung, Taiwan

Chih-Chiang Kao