Au Optronics Corporation

Chih-Chia Chen

Chien-Yuan Chen

Shih-Che Fu

Chung-Te Lee

Fu-Tung Chen

A circuit signal connection interface, a manufacturing method thereof, and an electronic device using the same are provided. The circuit signal connection interface includes a first signal line and a second signal line juxtaposed to each other, an insulation layer, and a first conductive pad. The first conductive pad electrically connects to the first signal line, and crosses the second signal line. Te insulation layer is disposed between the second signal line and the first conductive pad. The electronic device further includes a circuit device including a first conducting bump and a second conducting bump connected to each other in a parallel manner. The first conducting bump electrically connects to a first portion of the first conductive pad while the second conducting bump electrically connects to a second portion of the first conductive pad.

Circuit signal connection interface

A backlight module is provided. The backlight module includes a backplate, at least one supporter, and a plurality of light emitting devices. The supporter is disposed on the backplate, and includes a supporting portion and a buffering portion. The supporting portion is disposed between the buffering portion and the backplate. The elastic coefficient of the buffering portion is smaller than the elastic coefficient of the supporting portion. The light emitting devices are also disposed on the backplate. The supporter is disposed between the light emitting devices. The buffering portion of the supporter of the backlight module is adapted for buffering an external force applied upon the supporting porter or the element disposed thereupon.

Backlight module

A circuit signal connection interface, a manufacturing method thereof, and an electronic device using the same are provided. The circuit signal connection interface includes a first signal line and a second signal line juxtaposed to each other, an insulation layer, and a first conductive pad. The first conductive pad electrically connects to the first signal line, and crosses the second signal line. The insulation layer is disposed between the second signal line and the first conductive pad. The electronic device further includes a circuit device including a first conducting bump and a second conducting bump connected to each other in a parallel manner. The first conducting bump electrically connects to a first portion of the first conductive pad while the second conducting bump electrically connects to a second portion of the first conductive pad.

Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same

A liquid crystal display (LCD) includes a backlight module, a cell module installed in front of the backlight module, and a front frame which includes a frame body with holes and buffer material. The buffer material has a first part disposed in the holes and fixed to the cell module and backlight module through the front frame, and a second part sandwiched between the frame body and cell module. A method for manufacturing a LCD device is also provided, including forming a buffer material on a frame body by injection molding, firmly connecting the frame body, a cell module, and a backlight module, and locating the buffer material between the frame body and cell module.

LCD and backlight module, front frame, and back bezel thereof

An adhesive structure for use in a liquid crystal display (LCD) and a method for manufacturing the adhesive structure are provided. The adhesive structure includes a releasing paper which is provided with two anisotropic conductive films (ACFs) thereon. When the adhesive structure is attached onto the LCD, the two ACFs can be simultaneously attached onto the glass substrate of the LCD for connecting the integrated circuit and flexible printed circuit, respectively.

Growing community of inventors

Hsin-Chu, Taiwan

Chih-Chia Chen