Hon Hai Precision Industry Co., Ltd.

Scienbizip Consulting(shenzhen)co., Ltd.

Chih-Chen Lai

I-Thun Lin

Ga-Lane Chen

Han-Lung Lee

A photoelectric converting module includes a circuit board, at least one light emitting/receiving unit and an optical coupler both mounted on the circuit board. Each light emitting/receiving unit includes a light emitter and a light receiver, the light emitter and the light receiver each include at least one positioning projection. The optical coupler includes positioning parts to engage with the positioning projections for aligning the optical coupler with the light emitting/receiving unit precisely.

Photoelectric converting module

A color temperature adjusting method of solid state light emitting device, including steps: providing a main light source which emits main light of a first color temperature; providing an adjusting light source, wherein the adjusting light source comprises a red light source, a green light source and a blue light source; and adjusting currents applied to the adjusting light sources to obtain an adjusting light, wherein the adjusting light mixes with the main light of the main light source to obtain an outgoing light of a second color temperature. The second color temperature is different from the first color temperature. The outgoing light has a chromaticity coordinate at a Plank's curve on a CIE 1931 chromaticity coordinates chart.

Color temperature adjusting method of solid state light emitting device

Illuminating device

A photoelectric converting module includes a circuit board and an optical coupling member. The circuit board includes a substrate defining a plurality of heat-conducting through holes and a hot-curable adhesive layer covering the heat-conducting through holes. The optical coupling member is fixed to the substrate via the hot-curable adhesive layer.

Photoelectric converting module and method for assembling same with curable adhesive

A vehicle-mounted charging device includes a charging main body, an external module, an electric wire, and a lighting module. The charging main body includes a circuit board in a first shell, a power plug, and a first shell. A power socket of a vehicle connects to the circuit board. The external module includes a charging plug and a second shell. The charging plug is arranged in the second shell. The charging plug connects to a charging socket of an electronic device to recharge a battery of the electronic device. The electric wire is configured to electrically connect to the charging main body, the external module, and the lighting module to visually indicate the state of charge of the battery of the electronic device.

In-vehicle-mounted charging device

An optical coupling assembly includes a circuit board, at least one light emitter, at least one light receiver, and an optical coupling module. The circuit board includes a mounting surface and an alignment groove formed on the mounting surface. The at least one light emitter and at least one light receiver are mounted on the mounting surface. The optical coupling module includes at least two lenses and a positioning member. The positioning member is engaged with the alignment groove, with each of the at least one light emitter and the at least one light receiver being optically aligned with a respective one of the at least two first lenses.

Optical coupling assembly

A light guide plate includes a main body including a light emitting surface. A number of glues, each with a different, and lower, refractive index when cured, are applied through a covering plate onto the light emitting surface. Each type of glue forms a layer on the layer below, the stack of layers forms a plurality of spaced micro-rods on the light emitting surface. Each layer in the micro-rod thus includes top and bottom and side surfaces. The different refraction indexes of each layer, reducing along a direction from the light emitting surface to the top surface of each rod, causes light to be emitted substantially equally from the periphery of each layer in the micro-rod as well as from the top of each rod. The maximum refraction index of any layer in the micro-rod is not greater than that of the main body.

Light guide plate, method of manufacturing same, and backlight module having same

An optical fiber connector includes a housing, two coupling lenses, a RJ45 plug, a holder, and two optical fibers. The housing defines a receiving cavity with a bottom surface and two through holes. The coupling lens is positioned on the bottom surface and covers the through holes. The RJ45 plug is received in the receiving cavity and defines a receiving recess. The holder is received in the receiving recess and defines two receiving through holes. The optical fibers are received in the receiving through holes and optically aligned with the coupling lenses.

Optical fiber connector with optical fiber holder received in RJ45 plug

A method for manufacturing an LED chip, comprising steps: making a substrate and an epitaxy structure formed on the substrate, the epitaxy structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer; defining a plurality of grooves in the epitaxy structure to expose the light emitting layer; and filling a transparent insulative material in the plurality of grooves; wherein the plurality of grooves comprise a plurality of first grooves and a plurality of second grooves different from the plurality of first grooves, wherein the plurality of second grooves are spaced differently from the plurality of first grooves.

Method for manufacturing LED chip with groove

Color temperature adjusting method of solid state light emitting device and solid state light emitting device using the method

A method for manufacturing an LED die includes following steps: a semi-finished LED die is provided; an N-type layer, an active layer, and an P-type layer are sequentially formed on the transparent substrate; the transparent substrate is etched by laser to form a light outputting surface, the light outputting surface having a smoothly concave and arc-shaped configuration; common parts of the active layer and the P-type layer are removed to expose a part of the N-type layer; and an electrode structure is disposed on exposed N-type layer and the p-type layer to complete the formation of the LED die.

Method for manufacturing LED die

An adapter cable includes a first adapter, a second adapter, and a wire. The first adapter includes a sensor, a light source, and a processor. The sensor generates a detecting signal when sensing that the first adapter is picked up. The processor is connected between the sensor and the light source. The processor turns on the light source when receiving the detecting signal output from the sensor. The wire is connected between the first adapter and the second adapter.

Adapter cable having light source for lighting

A lamp system includes a laser source and a reflecting plate for reflecting light generated from the laser source. The laser source includes a laser diode, a light splitter for splitting light generated from the laser diode into a plurality of beams, a phosphor layer for changing color of the beams transmitted from the light splitter, and a diffusing layer for diffusing the beams transmitted from the light splitter, to thereby form a surface light source. The lamp system is configured to be used in a vehicle.

Laser lamp system for a vehicle

A portable electrical energy source provides power for a portable electronic device and includes a base, a chargeable battery, and a connector. The base includes a first surface and a second surface facing away from the first surface. The base defines a receiving room between the first surface and the second surface. The chargeable battery is received in the receiving room. The connector is positioned on the first surface and is electrically connected to the chargeable battery, which is electrically connected to the portable electronic device. The chargeable battery charges the portable electronic device through the connector.

Portable electrical energy source with increased power supply efficiency

A method to manufacture an LED backlight module comprising steps: providing a substrate with circuits arranged thereon; pasting a plurality of LEDs on the substrate; electrically conducting the LEDs with the circuits on the substrate; providing a luminance photometer to measure an illumination of the LEDs in luminous state and getting an actual light intensity distribution of the light of the LEDs through a brightening sheet and a diffusion sheet; providing a computer to detect whether the actual light intensity distribution has a dark/bright band/spot. If the actual light intensity distribution is uniform, the LEDs are soldered to the substrate directly. If there is dark/bright band/spot, the positions of LEDs in connection with the irregular light band/spot are adjusted to enable the light from the LED backlight module to have a uniform intensity distribution.

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Taipei, Taiwan

Chih-Chen Lai