Quanta Computer Incorporated

Ichia Technologies, Inc.

Chih-Chao Chen

Pei-Yu Chang

Chia-Hung Ma

Chih-Wei Jen

A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.

Heat dissipation assembly and electronic device using the same

A keypad structure with a backlight source includes a base, a light guiding plate, a thin film circuit board, a resilient component, a keycap, and an elevating mechanism. The thin film circuit board includes at least one exhausting notch for increasing exhaust as the resilient component is compressed. A plurality of microstructures is formed on the light guiding plate, and the keypad structure further includes a transparent layer formed on the keycap. Light emitted from the backlight source and refracted by the plurality of microstructures passes through the keycap and the transparent layer as the backlight source lights the lateral side of the light guiding plate, so as to illuminate the transparent layer. Thus, the present invention has advantages of illuminating pattern, regional illumination, and preferable comfort.

Growing community of inventors

Taoyuan, Taiwan

Chih-Chao Chen