Advanced Semiconductor Engineering, Inc.

Sunonwealth Electric Machine Industry Co., Ltd.

Chien-Yuan Tseng

Meng-Jen Wang

Chen-Tsung Chang

Chien-Hao Chen

An-Chi Tsao

Per-Ju Chao

Chih-Fang Wang

Shang-Ruei Wu

Cheng-Han Li

Alex Horng

Chi-Min Wang

Chi-Chih Chu

Cheng-Yi Weng

Hung Chen Kuo

Chia-Feng Hsu

Ying-Hao Wei

Yuan-Long Chiao

A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

Semiconductor device package

A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

Semiconductor package shielding structure

Semiconductor device package and method of manufacturing the same

An impeller includes a hub, a plurality of blades provided around an outer periphery of the hub, and at least two connecting rings connected to the plurality of blades. Each of the plurality of blades has a top edge and a bottom edge opposite to the top edge. One or more of the at least two connecting rings is disposed between but not connected to the top edges and the bottom edges of the plurality of blades. A cooling fan including the impeller is also provided.

Impeller and cooling fan including the impeller

A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

Described herein are stackable semiconductor device packages and related stacked package assemblies and methods. In one embodiment, a manufacturing method includes: (1) providing a substrate including contact pads disposed adjacent to an upper surface of the substrate; (2) applying an electrically conductive material to form conductive bumps disposed adjacent to respective ones of the contact pads; (3) electrically connecting a semiconductor device to the upper surface of the substrate; (4) applying a molding material to form a molded structure covering the conductive bumps and the semiconductor device; (5) forming a set of cutting slits extending partially through the molded structure and the conductive bumps to form truncated conductive bumps; and (6) reflowing the truncated conductive bumps to form reflowed conductive bumps.

Stackable semiconductor device packages

Growing community of inventors

Kaohsiung, Taiwan

Chien-Yuan Tseng