Taiwan Semiconductor Manufacturing Comp. Ltd.

Young Optics Inc.

Chien-Yi Chen

Yian-Liang Kuo

Yu-Ting Lin

Yi Min Liu

Yi-Chang Chen

Shang-Yi Wu

Yung-Sheng Huang

Hsien-Kuang Chiu

Min-Feng Ku

Kao-Chih Liu

Chia Hong Lin

A socket of a testing tool is configured to provide testing signals. A device-under-test (DUT) board is configured to provide electrical routing. An integrated circuit (IC) die is disposed between the socket and the DUT board. The testing signals are electrically routed to the IC die through the DUT board. The IC die includes a substrate in which plurality of transistors is formed. A first structure contains a plurality of first metallization components. A second structure contains a plurality of second metallization components. The first structure is disposed over a first side of the substrate. The second structure is disposed over a second side of the substrate opposite the first side. A trench extends through the DUT board and extends partially into the IC die from the second side. A signal detection tool is configured to detect electrical or optical signals generated by the IC die.

Repackaging IC chip for fault identification

A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Method of analyzing semiconductor structure

A method includes loading the semiconductor structure on a stage; providing a detector disposed above the semiconductor structure and the stage; applying a voltage to the semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage and recording a rotation of the stage after identifying the portion of the semiconductor structure; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

A method of forming an integrated circuit structure includes providing a wafer having a first semiconductor chip, a second semiconductor chip, and a scribe line between and adjoining the first semiconductor chip and the second semiconductor chip; forming a notch in the scribe line, wherein the notch has a bottom no higher than a top surface of a semiconductor substrate in the wafer; forming a first insulation film over the wafer, wherein the first insulation film extends into the notch; removing a portion of the first insulation film from a center of the notch, wherein a remaining portion of the first insulation film comprises an edge in the notch; and sawing the wafer to separate the first semiconductor chip and the second semiconductor chip.

Protecting sidewalls of semiconductor chips using insulation films

A reflector module for a projection system includes a base, a reflecting component provided with a reflecting surface, an axle unit, and at least one actuator. The base has a surrounding wall with a bottom side, and a bottom wall connected to the surrounding wall for closing the bottom side of the surrounding wall. The reflecting component is disposed in the base, and has side edges and an underside surface. The axle unit is disposed on the side edges of the reflecting component, and interconnects the surrounding wall of the base and the reflecting component such that the reflecting component is mounted tiltably in the base about the axle unit. The actuator is mounted between the bottom wall of the base and the underside surface of the reflecting component, and is operable to drive movement of the reflecting component to cause the reflecting surface to oscillate about the axle unit.

Growing community of inventors

Hsinchu, Taiwan

Chien-Yi Chen