Aic Inc.

Chien-Yang Lin

Chi-Fu Chen

Yen-Chih Chen

Hsih-Ting You

Wei-Ta Chen

A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Growing community of inventors

Taoyuan, Taiwan

Chien-Yang Lin