Realtek Semiconductor Inc.

Siliconware Precision Industries Co., Ltd.

Chien-Wei Lee

Chun-Tang Lin

Jeong-Fa Sheu

Han-Yi Hung

Hui-Min Huang

Sheng-Pin Lin

Yen-Ping Wang

A data communication and processing method of a master device and a slave device is provided, wherein the method includes the steps of: using the master device to transmit a frame to the slave device via a communication medium, wherein the frame includes a plurality of fields, the plurality of fields includes a bursting size field and a data field, and contents within the bursting size field indicate a data amount of the data field; and using the slave device to receive the frame and store contents of the data field, or output data to the data field according to the data amount indicated by the contents within the bursting size field of the frame. In addition, a method for replacing preamble bits with a postamble bit to improve transmission efficiency is provided.

Data communication and processing method of master device and slave device

A semiconductor structure includes a chip, a plurality of metal posts disposed in the chip and a buffer layer disposed on the chip. The chip includes a silicon-based layer having opposite first and second surfaces, and a build-up structure formed on the first surface of the silicon-based layer consisting of at least a metal layer and a low-k dielectric layer alternatively stacked on one another. Each of the metal posts is disposed in the silicon-based layer with one end thereof electrically connected with the metal layer while the other end is exposed from the second surface of the silicon-based layer. The buffer layer is disposed on the build-up structure. By positioning the low-k dielectric layer far from the second surface that is used for connecting to an external electronic component, the present invention reduces the overall thermal stress.

Semiconductor device and fabrication method thereof

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Taichung, Taiwan

Chien-Wei Lee