Lite-on Technology Corporation

Dell Products Inc.

Silitek Electronic (guangzhou) Co., Ltd.

Lite-on Opto Technology (changzhou) Co., Ltd.

Chien-Tung Huang

Chih-Yuan Chen

Tien-Yu Lee

Chun-Chang Wu

Shan-Yi Chang

Wei-Chien Hung

Shun-Cheng Hsu

Wei-Hsun Hsu

Wei-Lun Tsai

Wen-Kai Chang

Described herein is a temperature sensing module for determining and adjusting temperature of dual inline memory module (DIMM) of an information handling system. The temperature sensing module includes a flexible printed circuit (FPC) and a temperature sensor integrated into the FPC. The temperature sensor is configured to contact and receive temperature the DIMM. The received temperature is used to adjust temperature of the DIM by heating a heating pad. Fasteners are to connect the temperature sensing module to the DIMM.

Temperature sensor for dual inline memory modules (DIMM)

A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.

Chip-scale LED package structure

LED package

Growing community of inventors

Taipei, Taiwan

Chien-Tung Huang