Tmy Technology Inc.

Mediatek Corporation

Chien-Tse Fang

Wen-Tsai Tsai

Su-Wei Chang

Chueh-Jen Lin

Yang Tai

Po-Chia Huang

Yu-Cheng Lin

Shao-Chun Hsu

Wei-Yang Chen

Tai-Yu Chen

Jih-Ming Hsu

Tzu-Chieh Hung

Jiun-Wei Wu

Shun-Chung Kuo

Wei-Ting Wang

Yun-Ching Li

Pei-Yu Huang

Chi-Wen Pan

Chih-Yuan Hsiao

Wen-Tsan Hsieh

Chia-Feng Yeh

Tzu-Wen Chiang

Te-Liang Sun

Ying-Yen Lu

Chiao-Pin Fan

Yu-cheng Lin

Tsu-Wen Chiang

The present invention provides a method of dynamic thermal management applied to a portable device, wherein the method includes the steps of: obtaining a surface temperature of the portable device; obtaining a junction temperature of a chip of the portable device; and calculating an upper limit of the junction temperature according to the junction temperature and the surface temperature.

Method and apparatus of dynamic thermal management based on surface temperatures of portable device

An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

Antennas-in-package verification board

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Rapid over-the-air production line test platform

A transition structure for millimeter wave is provided. The transition structure includes a first layer signal element coupled to an end of a first transmission line and a plurality of first layer ground elements surrounding the end of the first transmission line equidistantly from the end of the first transmission line and disposed along two opposite sides of a strip body of the first transmission line equidistantly from the strip body of the first transmission line. The transition structure further includes an intermediate layer signal element coupled to the first layer signal element and a plurality of intermediate layer ground elements surrounding the intermediate layer signal element quasi-coaxially. A multilayer transition structure including a multilayer structure and the transition structure is also provided. Therefore, the problem of operating frequency caused by the thickness of the multilayer structure can be overcome, thereby increasing the resonance frequency of the multilayer structure.

Transition structure for coupling first and second transmission lines through a multi-layer structure and including a cavity corresponding to the second transmission line

The invention provides a thermal control method and a thermal control system. The thermal control method comprises: detecting a temperature variance of a component of the electronic device to generate a detecting result; and determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result. The thermal control system comprises: a detecting unit, for detecting a temperature variance of a component of the electronic device to generate a detecting result; and a determining unit, for determining a temperature threshold value for the integrated circuit as a throttling point according to the detecting result.

Thermal control method and thermal control system

Growing community of inventors

Taipei, Taiwan

Chien-Tse Fang