Via Labs, Inc.

Via Technologies, Inc.

Fu Jen Catholic University

Micro Lithography Inc.

Chien-Sheng Chen

Hsiao-Chyi Lin

Yi-Shing Lin

Cheng-Chung Lin

Ching-Bore Wang

Hao-Zhi Li

Wei-Jen Lee

A connection interface conversion chip, a connection interface conversion device and an operation method are provided. The connection interface conversion chip includes a USB interface circuit, a DP interface circuit, a USB core circuit and a switching circuit. The USB interface circuit is suitable for coupling to a USB connector. The DP interface circuit is coupled to a DP sink device through a DP connector. The USB core circuit is coupled to both the USB interface circuit and the DP interface circuit. The switching circuit is coupled to both the USB interface circuit and the DP interface circuit. The switching circuit supports only one specific conduction mode that only allows transmitting DP signals between the USB interface circuit and the DP interface circuit.

Connection interface conversion chip, connection interface conversion device and operation method

A connection interface conversion chip, a connection interface conversion device and an operation method are provided. The connection interface conversion chip includes a USB interface circuit, a DP interface circuit, a USB core circuit and a switching circuit. The USB interface circuit is suitable for coupling to a USB connector. The DP interface circuit is suitable for coupling to a DP connector. In a first operation mode, at least one USB signal pair received by the USB connector is transmitted to the USB core circuit through the USB interface circuit. The USB core circuit decodes the USB signal pair and generates DP data. The DP data is transmitted to the DP connector by the DP interface circuit. In a second operation mode, the DP data received by the USB connector is transmitted to the DP connector through the USB interface circuit, the switching circuit and the DP interface circuit.

A speaker diaphragm structure is installed inside a sound generator device which comprises a frame, a speaker diaphragm structure installed within the frame and a suspension edge whose inner perimeter is connected to the speaker diaphragm structure and whose outer perimeter is connected to the frame; herein the speaker diaphragm structure includes a diaphragm body and a composite material layer, in which the composite material layer is used for bonding onto the surface of the diaphragm body or attaching within the diaphragm body; moreover, the composite material layer is composed of one or more types of tetrapyrrole compounds as well as one or more types of metal ions; additionally, the composite material layer has a thickness smaller than the thickness of the diaphragm body, and is mainly applied to provide the performance effect of sound quality modifications.

Speaker diaphragm structure

A capacitor structure including a dielectric material layer and at least two metal layers is provided. The metal layers are disposed at intervals in the dielectric material layer. Each of the metal layers includes a zigzaging electrode, a first finger-shaped electrode and a second finger-shaped electrode. The zigzaging electrode forms a plurality of first concave parts disposed at one side of the zigzaging electrode and a plurality of second concave parts disposed at the other side of the zigzaging electrode. The first finger-shaped electrode includes a plurality of first extension parts. The first extension parts are respectively disposed in the first concave parts. The second finger-shaped electrode includes a plurality of second extension parts. The second extension parts are respectively disposed in the second concave parts. The zigzaging electrode in each of the metal layers is electrically coupled to the first and second finger-shaped electrodes of adjacent metal layers.

Growing community of inventors

Taipei, Taiwan

Chien-Sheng Chen