Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Shen Chen

Yu-Ping Tseng

Charlie Wang

Y J Chen

Wai-Ming Yeung

Danny Kuo

Yu-Hsuan Hsieh

Hsuan Lo

Shin-Puu Jeng

Po-Yao Lin

Shu-Shen Yeh

Ming-Chih Yew

Chin-Hua Wang

Yu-Sheng Lin

Chia-Kuei Hsu

Po-Chen Lai

A package assembly includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and attached to the package substrate. The package lid includes an outer lid including an outer lid material and including an outer lid plate portion. The package lid further includes an inner lid including an inner lid material different than the outer lid material and including an inner lid plate portion attached to a bottom surface of the outer lid plate portion.

Package assembly lid and methods for forming the same

A cleaning process monitoring system, comprising: a cleaning container comprising an inlet for receiving a cleaning solution and an outlet for draining a waste solution; a particle detector coupled to the outlet and configured to measure a plurality of particle parameters associated with the waste solution so as to provide a real-time monitoring of the cleaning process; a pump coupled to the cleaning container and configured to provide suction force to draw solution through the cleaning system; a controller coupled to the pump and the particle detector and configured to receive the plurality of particle parameters from the particle detector and to provide control to the cleaning system; and a host computer coupled to the controller and configured to provide at least one control parameter to the controller.

Method and apparatus for cleaning process monitoring

Growing community of inventors

Hsinchu, Taiwan

Chien-Shen Chen