Industrial Technology Research Institute

Other

Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Rong Huang

Chun-Hung Liu

Ching-Hsi Lin

Dimitre Zahariev Dimitrov

Tzong-Ming Wu

Kuan-Chou Chen

Tung-Po Hsieh

Tung-Li Lee

Ping-Yu Hu

Fu-Ming Lin

Wen-Yo Lee

Chih-Yi Lai

Yu-Sheng Wang

Chien-Hsing Lin

Shiue-Ru Wu

Yung-Chen Tsao

Chi-Pin Chen

Sheng-Kuo Huang

Chih-Yuan Ke

Jou Chyn

Shao-Kung Chang

Shen-Tai Liaw

An expandable photovoltaic submodule comprises an adapter. The adapter comprises: an upper level port, wherein the upper level port comprises a front-positive terminal, a front-negative terminal, a first rear-positive terminal, and a first rear-negative terminal; a lower level port, wherein the lower level port comprises a second rear-positive terminal and a second rear-negative terminal; a first solar cell port, wherein the first solar cell port comprises a cell positive terminal and a cell negative terminal; and a plurality of potential lines coupled to the upper level port, the lower level port, and the first solar cell port, wherein the plurality of potential lines are adapted to series or parallel connections of at least two levels.

Expandable photovoltaic submodules

A solar cell module includes a first solar cell, a second solar cell and an electrically connecting member. The first solar cell has a first connecting side having at least one first protruding portion and at least one first recess portion that are adjacent to each other. The second solar cell has a second connecting side having at least one second protruding portion and at least one second recess portion that are adjacent to each other. The shape of the first protruding portion matches the shape of the second recess portion while the shape of the first recess portion matches the shape of the second protruding portion. The electrically connecting member electrically connects the first upper electrode layer of the first solar cell and the second lower electrode layer of the second solar cell.

Solar cell module and solar cell thereof

A method of fabricating a solar cell is provided. A saw damage removal process is performed on a silicon substrate. A dry surface treatment is performed to a surface of the silicon substrate on form an irregular surface. A metal-activated selective oxidation is performed to the irregular surface. By using an aqueous solution, the irregular surface is etched to form a nanotexturized surface of the silicon substrate. A dopant diffusion process is performed on the silicon substrate to form a P-N junction. An anti-reflection layer is formed on the silicon substrate. An electrode is formed on the silicon substrate.

Method of fabricating solar cell

A method for producing a silicon substrate for solar cells is provided. The method includes performing a saw damage removal (SDR) and surface macro-texturing on a silicon substrate with acids solution, so that a surface of the silicon substrate becomes an irregular surface. Thereafter, a metal-activated selective oxidation is performed on the irregular surface with an aqueous solution containing an oxidant and a metal salt, in which the oxidant is one selected from persulfate ion, permanganate ion, bichromate ion, and a mixture thereof. Afterwards, the irregular surface is etched with an aqueous solution containing HF and HOso as to form a nano-texturized silicon substrate.

Method for producing silicon substrate for solar cells

A supervisory parallel switching device is designed for use with a CIM system including a host computer unit connected via an extended computer integrated unit to at least one equipment unit through an SECS-compliant (Semiconductor Equipment Communication Standard) serial communication link, for the purpose of allowing the equipment unit to be continuously under computer control even in the event of an unanticipated shutdown to the extended computer integrated unit. The supervisory parallel switching device includes a plurality of switching units, such as relays, under control by a control logic unit to be switched on in such a manner that, when the extended computer integrated unit operates normally, the control logic unit activates these switching units to connect both the equipment unit and the host computer unit to the extended computer integrated unit, allowing the equipment unit to be chiefly controlled by the extended computer integrated unit; while in the event of an unanticipated shutdown to the extended computer integrated unit, the control logic unit activates these switching units to connect the equipment unit directly to the host computer unit, thus allowing the equipment unit to be continuously controlled by the host computer unit. This feature allows each equipment unit in the CIM system to be uninterrupted in its fabrication process even where there is power failure or system crash in the extended computer integrated unit.

Supervisory parallel switching device for computer integrated manufacturing system with secs-compliant serial communication links

This invention uses the pattern-based signal to accelerate the evaluation process as a means to replace complicated computing procedures. This invention is constructed through implementing absolute coordinates to produce pattern-based signals by position and two optical sensor signals, and through conducting the feature extraction process. This process produces feature signals of sidelong and overlapped issues. Furthermore, through transforming signals, feature signals can be handled by the digital data processor. Thus, this invention can achieve the three main objectives of wafer mapping.

Wafer-mapping method of wafer load port equipment

An ultrasonic cleaning device fault detector, comprising an ultrasonic wave converter, an amplifier, a band-pass filter, and an integrator. The ultrasonic wave converter operates at the same central frequency as the ultrasonic cleaning device and is able to sense the intensity of ultrasonic waves generated by the ultrasonic cleaning device and to produce an analog signal therefrom. The amplifier amplifies the analog signal generated by the ultrasonic wave converter. The band-pass filter filters out noise in the analog signal, eliminating electric noise and other external noise that are sensed by the ultrasonic wave converter. The integrator converts the analog signal cleaned in the band-pass filter into an electric voltage digital signal output, thereby indicating whether the vibrating device of the ultrasonic cleaning device is working properly.

Ultrasonic cleaning device fault detector

A digital non-contact blade position detection apparatus is provided for use on a wafer dicing machine for blade position detection so as to correct the position of the cutting blade. The apparatus includes a light source for generating a light beam; a light converging optical unit for converting the light beam from the light source to a preset converging point; light diverting means for diverting the beam light from the light converging optical unit to a preset optical path in which the blade is interdisposed; a light diverging optical unit for diverging the diverted light beam from the light diverting means; a CCD position detector, disposed at a third predetermined distance from the light diverging optical unit, for detecting a displacament of a diffractive part of the light beam passing through the optical path between the first and second that is partly blocked out by the blade; an analog-to-digital converter for converting the analog displacement signal from the CCD position detector into digital data; and computer means for processing the digital data to thereby determine the required correction in the position of the blade due to wear to the blade. This apparatus has the benefits of performing the blade position detection in a non-contact manner, enhancing the resolving power to submicron level; allowing the detection to be unaffected by alien particles; and performing the blade position detection with quick response and high precision.

Digital non-contact blade position detection apparatus

An automated access device for lifting and placing back the end cover plates of lead-frame magazine during IC packaging process. It includes: (a) a 3-axis robotic arm a plurality of single-axis robots, adapted to carry out a positioning by horizontal and vertical motions; (b) an end cover plate temporary storage shelf, adapted to temporarily store a plurality of end cover plates removed from the magazine; (c) a guiding mechanism, adapted to provide positioning assistance of the end cover plates; and a gripper mechanism, installed in each the robotic arm. The gripper mechanism includes: (i) a suction disc; (ii) a first driver adapted to drive the suction disc to adhere to the end cover plates (iii) a second driver adapted to adjust the position of the suction disc; and (iii) a fixture cylinder having a first gripper adapted to position and fix the end cover plates to assure correct positioning and prevent the end cover plates from dropping during the motion of the robotic arm.

Automated access method and device for use with lead frame magazine end

The present invention discloses a frictional mount for engaging a monitor to a process chamber by utilizing a base member that has at least three apertures therethrough adapted for mounting at least one monitor and two fastening devices, a compressible member formed of a deformable material that has at least three apertures adapted for the at least one monitor and the two fastening devices to pass through, the compressible member is positioned in intimate contact with the base member, and a pressing member that is in intimate contact with the compressible member and has at least one aperture adapted for the at least one monitor to be mounted therethrough and two apertures adapted for receiving two fastening devices such that when the two fastening devices are engaged, the compressible member expands in a lateral direction and frictionally engages the internal peripheral surfaces of a recessed window in the process chamber.

Growing community of inventors

Hsinchu, Taiwan

Chien-Rong Huang