Visera Technologies Company Limited

Omnivision Technologies, Inc.

Chien-Pang Lin

Hsiao-Wen Lee

Tzu-Han Lin

Chia-Yang Chang

Tzy-Ying Lin

Pai-Chun Peter Zung

Peter Zung

Wei-Ko Wang

Shin-Chang Shiung

Sheng-Feng Lu

San-Yuan Chung

Weng-Chu Chu

Shih-Ming Chen

Ming-Hsun Sung

According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.

Lens modules and fabrication methods thereof

An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

Optoelectronic device chip having a composite spacer structure and method making same

Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.

Aspheric lens structures and fabrication methods thereof

An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.

Image sensor module having precise image-projection control

A test board for wafer level semiconductor testing is disclosed. The test board comprises a plurality of wires and microelectronic devices; and a plurality of test sockets on an upper surface of the test board. Each test socket comprises: a base member configured for attachment to the test board with a first set of screws, wherein the base member has a central opening exposing a portion of the underlying test board; an anisotropic conductive film disposed within the central opening of the base member; a chip to be tested, disposed on the anisotropic conductive film within the central opening of the base member; and a cover member overlying the chip, attached to the base member with a second set of screws.

Test socket and test board for wafer level semiconductor testing

Growing community of inventors

Hsinchu County, Taiwan

Chien-Pang Lin