Zhen Ding Technology Co., Ltd.

Chien-Pang Cheng

A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits.

Method for manufacturing multilayer printed circuit board

A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.

Printed circuit board with fins

An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals.

Multilayer printed circuit board and method for making same

A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings.

Method for manufacturing rigid-flexible printed circuit board

An apparatus for heating and pressing a printed circuit board includes a first pressing member, a second pressing member, a driving member, a heater and an electromagnetic assembly. The driving member is configured for driving the first pressing member and the second pressing member to move toward or away from each other. The heater is configured for heating one of the first and second walls, and the electromagnetic assembly is capable of generating a magnetic field to attract the second wall to create additional pressure.

Apparatus and method for pressing printed circuit board

A clamping apparatus includes a receiving frame, a guide plate, two drive assemblies, and two clamping assemblies. The receiving frame includes two parallel securing arms and a connection arm. The securing arms and the connection arm define a first receiving space. Each of the securing arms defines a slot. The guide plate is configured for mounting of a workpiece thereon. The drive assemblies are configured for cooperatively moving the guide plate between a first position and a second position. When the guide plate is located at the first position, the workpiece is loaded on the guide plate and distant from the connection arm. When the guide plate is located at the second position, the workpiece is adjacent to the connection arm and entirely received in the first receiving space and the slots. The clamping assemblies are configured for cooperatively clamping the workpiece.

Clamping apparatus

An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Electroplating apparatus

A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member.

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Tayuan, Taiwan

Chien-Pang Cheng