Sun Microsystems, Inc.

Oracle America, Inc.

Other

Stats Chippac Pte. Ltd.

Chien Ouyang

Ali Heydari

Kenneth Clayton Gross

Kenny C Gross

Rajendra D Pendse

Mukul Joshi

Xiao Gu

Yonghyuk Jeong

Michael Mingliang Liu

A semiconductor device is made by calculating a thermal resistance matrix for the semiconductor device. A plurality of maximum junction temperatures for the plurality of die of the semiconductor device is selected. A plurality of power envelope surfaces are calculated for the semiconductor device based on the thermal resistance matrix and the maximum junction temperatures. A plurality of powers is selected for the plurality of die. The plurality of powers are compared against the plurality of power envelope surfaces to determine a plurality of risk values.

Power envelope analysis for the thermal optimization of multi-chip modules

A robotic mapping and tracking system including a robot and boundary posts are disclosed. The robot includes an ultrasonic transmitter, a processor and a camera component. The boundary posts are configured to be placed adjacent to a boundary of a working region. Each boundary post of the plurality of boundary posts includes an ultrasonic receiver. Time-of-flights of the ultrasonic waves are measured to identify distances in between the robot and boundary posts. The camera component of the robot captures an image of an environment of the robot. The processor of the robot analyzes the image of the environment and identifies at least a portion of the working region in front of the robot from the image. The processor of the robot determines a moving route based on the identified portion of the working region in front of the robot and the distances in between the robot and the boundary posts.

Mapping and tracking system for robots

At least some embodiments of the present invention disclose a robotic lawn mowing system coupled with boundary stands to control and to monitor the moving of the robotic lawn mower. The robotic lawn mower uses boundary stands to identify the lawn boundary, to determine the position of the robotic lawn mower in a lawn, and to define the mowing routes. The ultrasonic and RF devices are placed on the robotic lawn mower and on the boundary stands. Based on the disclosed technology, users can define and design the mowing routes to mow the lawn according to their preferences. The control of the robotic lawn mower may be wireless, and users may monitor and control the robotic lawn mower with a computer, a cell phone, or a tablet through a wireless network.

Robotic lawn mower with boundary stands

The smart robotic lawn mowing system utilizes the ultrasonic and RF devices placed on the robotic lawn mower and boundary stands to define the mowing area, to track the position of the robotic lawn mower, and to control and monitor the mowing routes. The installed devices form a network sensor for the mowing system to determine the relative distances in between boundary stands and robotic lawn mower. The couplings of robotic lawn mower and boundary stands may further define the mowing sequences of areas, the size of areas, and the mowing routes inside each area. The control of the robotic lawn mower may be wireless and users are able to monitor and modify the settings with a computer, a cell phone, and a tablet through a wireless network, a WIFI, or an internet.

Robotic lawn mower with network sensors

Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.

Integrated circuit chip cooling using magnetohydrodynamics and recycled power

A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the electrodes coupled with dielectric pieces and heat sink fins induce the gas flow, which is used to cool down heat sources. A magnetic circuit may be coupled with plasma-drive gas flow to enhance the cooling.

Plasma-driven cooling heat sink

A heat source is cooled by employing heat pipes, magneto-hydrodynamic fluid pipes, and a heat sink. Heat is transmitted from evaporating ends of the heat pipes connected to the heat source to condensing ends of the heat pipes connected to the heat sink. The magneto-hydrodynamic fluid is circulated inside the magneto-hydrodynamic fluid pipes. Magnetic fields are generated using an array of magnets and an electric potential is created from a top surface to a bottom surface of each magneto-hydrodynamic fluid pipe using metal films. The magnetic fields and electric potential induce an electrically-conductive magneto-hydrodynamic fluid to circulate in the magneto-hydrodynamic fluid pipes thereby dissipating heat from the heat sink.

Enhanced heat pipe cooling with MHD fluid flow

A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Integrated circuit system with stress redistribution layer and method of manufacture thereof

A method for cooling a semiconductor including passive cooling including transferring heat via passive cooling components; active cooling including transferring heat via active cooling components; and controlling the active cooling based on temperature of the semiconductor. A cooling system for a semiconductor including: a passive component in thermal contact with the semiconductor; an active cooling component in thermal contact with the semiconductor; and a controller controlling the active cooling component.

Intelligent cooling method combining passive and active cooling components

A cooling device includes a base having cells. A pipe is coupled to the base for each of the cells. The pipes include passages that carry fluid toward the cell and away from the cell. A magnetohydrodynamic pump system coupled to the pipe circulates an electrically conductive cooling fluid within the passages and the cell. An orifice may emits jets of fluid into the cells. A controller coupled to the cooling device may independently control flow rates in two or more cells of the cooling device. The controller may receive information from the temperature sensors on the base of the cooling device for use in controlling the flow rates in the cells.

Multichannel cooling system with magnetohydrodynamic pump

A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.

Magneto-hydrodynamic hot spot cooling heat sink

One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.

Micro thrust cooling

A system for cooling a semiconductor includes a heat sink in thermal contact with the semiconductor, a thermal interface material (TIM) layer disposed between the heat sink and the semiconductor, and a picture frame support disposed between a substrate of the semiconductor and the heat sink, wherein the picture frame support encloses at least a portion of the semiconductor in a plane between the substrate and the heat sink, and wherein the picture frame support has a height that is greater than a height of the semiconductor.

Lidless semiconductor cooling

A system for cooling a semiconductor device is disclosed. The system includes a lid encasing the semiconductor device, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. Furthermore, a second system for cooling a semiconductor device is disclosed. The second system includes a lid, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. The lid is configured to be mounted over and encase the semiconductor device. Additionally, a method for cooling a semiconductor device is disclosed. The method includes disposing a first plurality of carbon nanotubes within a lid, mounting the lid over the semiconductor device, and passing a fluid through the lid.

Growing community of inventors

San Jose, CA, United States of America

Chien Ouyang