Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Ning Yao

Sai-Hooi Yeong

Zhi-Chang Lin

Shih-Cheng Chen

Jung-Hung Chang

Chi-On Chui

Kuo-Cheng Chiang

Chih-Hao Wang

Lo-Heng Chang

Bo-Feng Young

Tsung-Han Chuang

Kuan-Lun Cheng

Kuan-Ting Pan

Kai-Lin Chuang

Lo Heng Chang

A semiconductor device structure is provided. The semiconductor device structure includes a transistor which includes a source/drain feature adjoining an active region, and a gate stack over the active region. The semiconductor device structure further includes a capacitor above the transistor, the capacitor including a bottom electrode layer on the gate stack and a ferroelectric layer on the bottom electrode layer. The ferroelectric layer is made of a Hf-based dielectric material. The semiconductor device structure further includes gate spacer layers surrounding the gate stack, the bottom electrode layer and the ferroelectric layer.

Semiconductor device structure and method for forming the same

A semiconductor device structure is provided. The semiconductor device structure includes a plurality of first nanostructures stacked over a substrate in a vertical direction. The semiconductor device structure also includes a first bottom layer formed adjacent to the first nanostructures, and a first dielectric liner layer formed over the first bottom layer and adjacent to the first nanostructures. The semiconductor device structure further includes a first source/drain (S/D) structure formed over the first dielectric liner layer, and the first S/D structure is isolated from the first bottom layer by the first dielectric liner layer.

Semiconductor device structure including stacked nanostructures

Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a substrate and a bottom isolation feature formed over the substrate. The semiconductor structure also includes a bottom semiconductor layer formed over the bottom isolation feature and nanostructures formed over the bottom semiconductor layer. The semiconductor structure also includes a source/drain structure attached to the nanostructures and covering a portion of the bottom isolation feature.

Method for manufacturing semiconductor structure with isolation feature

Provided are a semiconductor device and a method of forming the same. The semiconductor device includes a substrate, a plurality of semiconductor nanosheets, a source/drain (S/D) region, a gate stack, and a liner layer. The substrate includes at least one fin. The plurality of semiconductor nanosheets are stacked on the at least one fin. The S/D region abuts the plurality of semiconductor nanosheets. The gate stack wraps the plurality of semiconductor nanosheets. The liner layer lines a bottom surface and a sidewall of the S/D region and is sandwiched between the S/D region and the gate stack.

Method of forming semiconductor device

A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.

Gate all around transistor with dual inner spacers

Gates having air gaps therein, and methods of fabrication thereof, are disclosed herein. An exemplary gate includes a gate electrode and a gate dielectric. A first air gap is between and/or separates a first sidewall of the gate electrode from the gate dielectric, and a second air gap is between and/or separates a second sidewall of the gate electrode from the gate dielectric. A dielectric cap may be disposed over the gate electrode, and the dielectric cap may wrap a top of the gate electrode. The dielectric cap may fill a top portion of the first air gap and a top portion of the second air gap. The gate may be disposed between a first epitaxial source/drain and a second epitaxial source/drain, and a width of the gate is about the same as a distance between the first epitaxial source/drain and the second epitaxial source/drain.

Gate air spacer for fin-like field effect transistor

A device includes a substrate. A first channel region of a first transistor overlies the substrate and a source/drain region is in contact with the first channel region. The source/drain region is adjacent to the first channel region along a first direction, and the source/drain region has a first surface opposite the substrate and side surfaces extending from the first surface. A dielectric fin structure is adjacent to the source/drain region along a second direction that is transverse to the first direction, and the dielectric fin structure has an upper surface, a lower surface, and an intermediate surface that is disposed between the upper and lower surfaces. A silicide layer is disposed on the first surface and the side surfaces of the source/drain region and on the intermediate surface of the dielectric fin structure.

Semiconductor device with wrap around silicide and hybrid fin

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure includes a nanostructure over the fin. The semiconductor device structure includes a gate stack wrapping around an upper portion of the fin and the nanostructure. The semiconductor device structure includes an inner spacer between the fin and the nanostructure. The semiconductor device structure includes a film in the inner spacer. A first dielectric constant of the film is lower than a second dielectric constant of the inner spacer. The semiconductor device structure includes a low dielectric constant structure in the film.

Semiconductor device structure with inner spacer

A method for forming a semiconductor structure is provided. The method includes forming a fin structure over a substrate. The fin structure includes a protection layer and alternating first and second semiconductor layers over the protection layer. The method also includes etching the fin structure to form a source/drain recess, forming a sacrificial contact in the source/drain recess, forming a source/drain feature over the sacrificial contact in the source/drain recess, removing the first semiconductor layers of the fin structure, thereby forming a plurality of nanostructures, forming a gate stack wrapping around the nanostructures, removing the substrate thereby exposing the protection layer and the sacrificial contact and replacing the sacrificial contact with a contact plug.

Semiconductor structure and method for forming the same

A device includes a semiconductor substrate, a channel layer, a gate structure, source/drain epitaxial structures, and a dielectric isolation layer. The channel layer is over the semiconductor substrate. The gate structure is over the semiconductor substrate and surrounds the channel layer. The source/drain epitaxial structures are connected to the channel layer and arranged in a first direction. The dielectric isolation layer is between the gate structure and the semiconductor substrate. The dielectric isolation layer is wider than the gate structure but narrower than the channel layer in the first direction.

Semiconductor device

A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a first fin structure over the substrate, and a FeFET device over a first region of the substrate. The FeFET includes a first gate stack across the first fin structure. The semiconductor device structure also includes first gate spacer layers alongside the first gate stack, and a ferroelectric layer over the first gate stack. At least a portion of the ferroelectric layer is located between upper portions of the first gate spacer layers and is adjacent to the first gate stack.

Semiconductor device structure

Fin-like field effect transistors (FinFETs) and methods of fabrication thereof are disclosed herein. The FinFETs disclosed herein have gate air spacers integrated into their gate structures. An exemplary transistor includes a fin and a gate structure disposed over the fin between a first epitaxial source/drain feature and a second epitaxial source/drain feature. The gate structure includes a gate electrode, a gate dielectric, and gate air spacers disposed between the gate dielectric and sidewalls of the gate electrode.

A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin over the base. The semiconductor device structure also includes a first nanostructure over the fin and a second nanostructure over the first nanostructure. The semiconductor device structure further includes a gate stack wrapping around an upper portion of the fin, the first nanostructure, and the second nanostructure. In addition, the semiconductor device structure includes a first inner spacer between the fin and the first nanostructure and a second inner spacer between the first nanostructure and the second nanostructure. The semiconductor device structure includes a first low dielectric constant structure in the first inner spacer and a second low dielectric constant structure in the second inner spacer. The first low dielectric constant structure is larger than the second low dielectric constant structure.

A device includes a substrate, a semiconductor layer, a gate structure, source/drain regions, a bottom isolation layer, and a bottom spacer. The semiconductor layer is above the substrate. The gate structure is above the substrate and surrounds the semiconductor layer. The source/drain regions are on opposite sides of the semiconductor layer. The bottom isolation layer is between the substrate and the semiconductor layer. The bottom spacer is on a sidewall of the bottom isolation layer. The bottom isolation layer has a seam therein, and the seam exposes a sidewall of the bottom spacer.

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Hsinchu, Taiwan

Chien-Ning Yao