Taiwan Semiconductor Manufacturing Comp. Ltd.

Chien-Ming Sung

Chen-Hua Douglas Yu

Jean Wang

Henry Lo

Kewei Zuo

Simon Wang

Jia-Ren Chen

Ya-Chun Teng

Sung-Yu Lin

A device includes first and second dies and a seal ring. The first die includes a top dielectric layer. The second die is over the first die. The second die includes a bottom dielectric layer bonded to the top dielectric layer of the first die at an interface between the first die and the second die. The seal ring extends from the first die to the second die through the interface. A portion of the top dielectric layer of the first die and a portion of the bottom dielectric layer of the second die are separated by a gap outside the seal ring.

Seal ring for bonded dies

A semiconductor manufacturing line includes an inert environment selected from the group consisting essentially of an inert airtight wafer holder, an inert wafer transport channel, an inert production tool, an inert clean room, and combinations thereof.

Preventing contamination in integrated circuit manufacturing lines

Growing community of inventors

Tainan, Taiwan

Chien-Ming Sung