Chroma Ate Inc.

Mediatek Corporation

Industrial Technology Research Institute

Weltrend Semiconductor Inc.

Amphenol East Asia Limited Taiwan Branch (h.k.)

Au Optronics Corporation

Tsinghua University

Wistron Neweb Corporation

Powertech Technology Inc.

Mediatek Incorporation

Everlight Usa, Inc.

Everlight Chemical Industrial Corporation

Rec Technology Corporation

Chien-Ming Chen

Chin-Yi Ouyang

Hsueh-Shih Chen

Meng-Kung Lu

Gwo-Yang Chang

Chih-Hsiang Lin

Hsuan-Ying Chen

Chih-Chien Huang

Xin-Yi Wu

Jen-Chun Chiu

Sheng-Lung Chang

Te-Wei Hsu

Ching-san Wu

Dai-Luon Lo

Yun-Jui Cheng

Szu-Ting Liao

Yung-Chan Lin

Fu-Ming Chien

Chen-Yu Hsiao

Sheng-Ju Liao

Chien-Chung Yang

Chin-Yi Ou Yang

Chia-Feng Chiang

Yao-Chu Chung

Wei-Cheng Kuo

Chih-Jen Chang

Chi-Chen Wu

Jui-Hsiung Chen

Yung-Chih Chen

Ming-Yuan Huang

An-nan Chang

Sung-Han Wen

Yih-Her Chang

Hsin-Ching Kao

Ming-Lung Chen

Yuan-Chung Lee

Chih-Wen Chen

Meng-Hsin Chen

Hung-Min Sun

Chuh-Yung Chen

Cheng-Hsing Fan

Herbert Tsai

Hsiao-San Chen

Po-Hsien Ho

Chuan-Hung Hsiao

Ying-Tzung Wang

Jin-An Wu

Hung-Chih Chiang

Shang-Yi Lin

Ching-Chou Yu

Ting-Feng Su

Shihn-Juh Liou

Wen-Chin Lin

Chih-Hung Lee

Shyh-Yang Lee

Fan-Jie Lin

Chien-Wen Lee

Chun-Ying Li

Yen-Chen Lin

Jun-Ren Lo

Tsung-I Lin

Pin-Huan Hsu

Hui-Jung Wu

Do-Yu Lee

Hsuan-Jen Shen

Hsien-Ming Chen

Hsiang-Sung Huang

Feng-Jen Tsai

Kuo-Pin Lan

Wei-Liang Lee

Ching-Shan Wu

Ming Cheng Huang

Ya-Huang Huang

Bo-An Su

Chien-Yi Liao

Ko-Chou Chen

Chung-Jen Wu

Hurng-Rern Lee

Iching Tsai

Yu-Hsuen Wang

Yen-Po Liu

Chi-Wei Wang

Yi-Sheng Xu

Ming-Feng Wu

Sheng-Fu Wen

Shun-Te Lin

Shih-Pu Hsu

Chin-Tui Chien

The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

Quick release assembly for a pressing head and electronic device testing apparatus having the same

A super-resolution image reconstruction method includes acquiring a plurality of raw images, positioning the plurality of raw images, acquiring a plurality of motion vectors, setting image coordinates of a super-resolution image, adjusting image coordinates of the super-resolution image according to the plurality of motion vectors for generating a plurality of updated image coordinates, setting a first image range, adjusting coordinates of a first image range according to the plurality of motion vectors for generating a plurality of updated first image ranges, generating a plurality of second image ranges according to each updated first image range, and generating a reconstructed pixel of the super-resolution image at the image coordinates according to a plurality of weightings, the plurality of updated first image ranges, and the plurality of second image ranges.

Super-resolution image reconstruction method and super-resolution image reconstruction system capable of dynamically adjusting weightings according to temporal information

The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

Electronic device testing apparatus and electronic device testing method

An auto white balance adjusting method includes acquiring an image, allocating N windows inside the image according to color information of the image, filtering out M windows from the N windows for generating N-M windows according to feature information of the N windows, grouping the color temperatures of the N-M windows for generating at least one color temperature group according to a standard color temperature curve, setting a first weighting of the at least one color temperature group according to a correlation between the at least one color temperature group and the standard color temperature curve, setting a second weighting of the at least one color temperature group according to spatial information of the at least one color temperature group of the image, and adjusting a white balance of the image according to color information, the first weighting, and the second weighting.

Auto white balance adjusting method and auto white balance adjusting system by using dynamic window allocations

The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

Electronic device pick-and-place system and electronic device testing apparatus having the same

A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

Position calibration system and method

The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

Chip tray positioning device

The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

Chip transfer device capable of floatingly positioning a chip and method for floatingly positioning a chip

The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Multistory electronic device testing apparatus

A pretreatment liquid for water-based pigment textile printing is disclosed, which includes: 1 wt % to 30 wt % of aqueous non-ionic polyurethane; 1 wt % to 20 wt % of a metal salt; 0.1 wt % to 10 wt % of a melamine resin; and the balance being a solvent. A method for forming a pattern on a textile using the aforesaid pretreatment liquid is also disclosed.

Pretreatment liquid for water-based pigment textile printing and method for forming pattern on textile

The present invention relates to a low-thermal resistance pressing device for a socket, which mainly comprises a housing, an inner collar, a heat conductive pressing block, a bearing collar and a locking member. The locking member on the housing is used to lock the socket. The inner collar is threadedly engaged with the housing. The bearing collar is located between the inner collar and the heat conductive pressing block. In the case of rotating the inner collar in the housing, the bearing collar drives the heat conductive pressing block to move axially so as to exert an axial force to a device to be tested. Because the heat conductive pressing block protrudes from the upper and lower surfaces of the housing, one end thereof can be in contact with a temperature control module, and the other end thereof can be in contact with the device to be tested.

Low-thermal resistance pressing device for a socket

An image color brightness compensation method includes generating image data of a plurality of pixels by using a Bayer color filter of an image sensing unit, generating demosaic image data after the image data of the plurality of pixels is processed by a demosaic process, executing a linear combination process of the demosaic image data by using at least one matrix for generating output image data, processing the output image data by using a blending unit for generating blended image data, generating a brightness compensation gain of the blended image data, and compensating image brightness of the blending image data for generating brightness compensated image data according to the brightness compensation gain.

Image color brightness compensation method and image color brightness compensation system by using a bayer color filter and a demosaic process

A selective laser sintering composition and a selective laser sintering 3D printing method employing the same are provided. The selective laser sintering composition includes a nanoscale inorganic powder and a thermoplastic vulcanizate powder. The temperature difference (&#x394;T) between the onset temperature for melting the thermoplastic vulcanizate powder and the onset temperature at which the thermoplastic crystallizes vulcanizate powder is greater than or equal to 10&#xb0; C. The thermoplastic vulcanizate powder includes a thermoplastic and a crosslinked polymer. The temperature difference (&#x394;T) between the onset temperature for melting the thermoplastic and the onset temperature at which the thermoplastic crystallizes is greater than or equal to 10&#xb0; C. , and the weight ratio of the thermoplastic to the crosslinked polymer is from 1:1 to 1:4.

Selective laser sintering composition and selective laser sintering 3D printing method employing the same

A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

Rotatable cushioning pick-and-place device

The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

Sliding test device for electronic components

Growing community of inventors

Hsinchu, Taiwan

Chien-Ming Chen