Taiwan Semiconductor Manufacturing Comp. Ltd.

Nyquest Corporation Limited

Chien-Lung Chen

Ying-Hao Wang

Chien-Chi Tzeng

Hu-Wei Lin

I-Hsuan Chen

Meng-Fu Shih

Shih-Chieh Huang

Chia-Han Chuang

Jhe-Hong Wang

A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

Automatic optical inspection system and method

An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Apparatus and methods for cleaning a package

An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

Systems for improved efficiency of ball mount cleaning and methods for using the same

The present disclosure provides an audio quantization coding and decoding device and a method thereof. In the method, before a quantization coding process is performed on a digital signal, the signal is pre-processed, the digital signal is split into multiple frames based on positive and negative half periods of the signal, and all audio data between two adjacent zero-crossing points belongs to the same positive and negative half periods, so as to have the same sign-bit. A pre-processing module groups the numeric data belonging to the same positive and negative half periods into the same frame. When coding, an audio quantization coding module only needs to record a sign-bit of the frame at a head of the frame, so the sign-bit of each batch of voice data in the frame may be omitted to reduce a data amount or improve a resolution of each batch of voice data.

Growing community of inventors

Hsinchu, Taiwan

Chien-Lung Chen