Edison Opto Corporation

Asustek Computer Inc.

Chien-Jung Wu

Tsung-Ting Sun

Kuo-Feng Tseng

Chung-Wei Kuo

Ming-Chuan Lee

Han-Pin Pan

A light-emitting module has better white light color rendering index to provide white rendering effect in accordance with the requirements of various application sites. The light-emitting module includes a (circuit) substrate board and at least one ultraviolet ray emitter and at least one blue light emitter disposed on the substrate board. The light wavelength of the ultraviolet ray emitter ranges from 380 nm to 420 nm. The light wavelength of the blue light emitter ranges from 440 nm to 470 nm. A wavelength conversion layer is laid on the substrate board. The wavelength conversion layer includes a first wavelength conversion material and a second wavelength conversion material for receiving and converting the light emitted from the ultraviolet ray emitter into visible light and the light emitted from the blue light emitter into white light. After the lights are mixed, a white general output optical spectrum is achieved.

Light-emitting module

A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Detachable capacitor device

A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: covering a light-reflection layer onto a substrate layer, covering a light-emitting layer onto the light-reflection layer, and forming a P type electrode and an N type electrode extended from the light-emitting layer, perforating through the light-reflection layer, and exposed from the substrate layer to form an LED chip structure; packaging the LED chip structure with a light-transmissible packaging material and keeping the P type electrode and the N type electrode exposed from the light-transmissible packaging material to form a molded LED chip cell; and electrically connecting the P type electrode and the N type electrode of the molded LED chip cell to a circuit board, so as to manufacture the LED assembly.

Method for manufacturing light emitting diode assembly

A LED lamp with 360-degree illumination includes a base, a first substrate, a stepped structure, a plurality of LEDs, and a cover. The first substrate is fixed on the base. The stepped structure is mounted on the first substrate. The stepped structure has a first annular frame connected to the first substrate, a second substrate connected to the first annular frame, and a second annular frame connected to the second substrate. The peripheral length of the second annular frame is smaller than that of the first annular frame. The plurality of LEDs is fixed to the first substrate and the second substrate and surrounds the first annular frame and the second annular frame respectively. With this arrangement, the LEDs can be arranged in a multi-storey stepped structure to generate an effect of 360-degree illumination. Also, the illumination range of the lamp can be increased.

Growing community of inventors

Taipei, Taiwan

Chien-Jung Wu