Taiwan Semiconductor Manufacturing Comp. Ltd.

Chunghwa Picture Tubes, Ltd.

United Microelectronics Corp.

Mosel Vitelic Corporation

Other

Hon Hai Precision Industry Co., Ltd.

Yahoo! Inc.

Industrial Technology Research Institute

Verizon Patent and Licensing Inc.

Au Optronics Corporation

National Taiwan University

Asustek Computer Inc.

Inventec Corp.

Inventec (pudong) Technology Corporation

Oath Inc.

Chien-Hung Zordius Chen

Chun-Chieh Chiu

Chung-Hui Chen

Tsung-Hsien Tsai

Min-Shueh Yuan

Hsiang-Tan Lin

Chung-Shu Lee

Yu-Tse Kuo

Meng-Chao Kao

Meng-Ping Chuang

Yung-Chow Peng

Chun-Hsien Huang

Chun-Yen Tseng

Ching-Cheng Lung

Yung-Chieh Chao

Kuo-Hsun Huang

Teng-Yi Huang

Chao-Yao Chiang

Shin-Puu Jeng

Po-Yao Lin

Chih-Chiang Chang

Shu-Shen Yeh

Yu-Sheng Lin

Shu-Ru Wang

Po-Zeng Kang

Mao-Hsuan Chou

Li-Ping Huang

Tzu-Chiang Shen

Chih Ming Yang

Chi-Di An

Chun-Hsien Wu

Yu-Juan Chan

Young-Chow Peng

Min-Jui Kao

Chao-Ching Hsu

Hsu Yang

Chun-Hsien Lin

Ching-Wen Hung

Chun-Hung Chen

Kuang-Chao Chen

Po-Chen Lai

Kai-Ming Ching

Li-Ho Yao

Mu-Jen Huang

Tong-Yu Chen

Min-Chieh Chou

Shih-Chieh Lin

Shao-Yu Li

Hsueh-Hao Shih

Chih-Lung Lin

Chen-Hsien Hsu

Wei-Jen Wang

Chin-Yueh Liao

Chien-Fu Chen

Hsuan-Jung Su

Tsung-Yang Hung

Pei-Lin Hsieh

Chun-Jung Tsuo

Hui-Chang Yu

Ming-Kuan Kao

Lih-Hsiung Chan

Yue-Li Chao

Yi-Fu Chung

Yun-Long Tun

Sung-Fu Wu

Chih-Ming Yang

Feng-Chih Tsai

Shih-Chang Lee

Chun-Lun Pan

Chih-Huang Lien

Hui-Ting Shen

Jung-Chang Lu

Hsien-Kai Tseng

Chia-Cheng Tu

Hsi-Chang Chang

Shih-Meng Chang

Fa-Ping Wang

Chien-Yu Tseng

Yu-Hung Li

Leon Chang

Yi-Shin Chang

Yu-Min Cheng

Chao-Kai Liu

Ming-Jye Tasi

Jhe-Yu Lin

San-Chi Ho

Hung-Chun Chang

Chen-Chieh Hong

Chen-Chin Kuo

Cheng-Ping Hsieh

Chih-Chung Yen

Ming-Hui Liu

Chih-Yih Yao

Yi-Fu Chang

Sung Kun-Yu

Martin Lin

Chu-Yen Wu

Chi-Wei Tien

Chih-Feng Shen

Chin-Hsing Tsai

A semiconductor device includes a circuit substrate, at least one semiconductor die, a first frame, and a second frame. The at least one semiconductor die is connected to the circuit substrate. The first frame is disposed on the circuit substrate and encircles the at least one semiconductor die. The second frame is stacked on the first frame. The first frame includes a base portion and an overhang portion. The base portion has a first width. The overhang portion is disposed on the base portion and has a second width greater than the first width. The overhang portion laterally protrudes towards the at least one semiconductor die with respect to the base portion. The first width and the second width are measured in a protruding direction of the overhang portion.

Frames stacked on substrate encircling devices and manufacturing method thereof

A package structure and a formation method of a package structure are provided. The package structure includes a circuit substrate and a die package bonded to the circuit substrate through bonding structures. The package structure also includes a warpage-control element attached to the circuit substrate. The warpage-control element has a protruding portion extending into the circuit substrate. The warpage-control element has height larger than that of the die package.

Structure and formation method of package with warpage-control element

A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.

Semiconductor package and method of manufacturing the same

A method for fabricating a static random access memory (SRAM) includes the steps of: forming a gate structure on a substrate; forming an epitaxial layer adjacent to the gate structure; forming a first interlayer dielectric (ILD) layer around the gate structure; transforming the gate structure into a metal gate; forming a contact hole exposing the epitaxial layer, forming a barrier layer in the contact hole, forming a metal layer on the barrier layer, and then planarizing the metal layer and the barrier layer to form a contact plug. Preferably, a bottom portion of the barrier layer includes a titanium rich portion and a top portion of the barrier layer includes a nitrogen rich portion.

Static random access memory and method for fabricating the same

Among other things, one or more client devices, techniques, and/or systems are provided for orientation selection. A first user and a second user are detected within a range of a detection component, such as a camera, of a client device. A position of a face of the first user is identified relative to a screen of the client device (e.g., near a right side). A second position of a second face of the second user is identified relative to the screen (e.g., near a left side). An element of an application, displayed by the client device, is presented in a first orientation (e.g., a landscape orientation facing to the right side) based upon the position of the face and a second element of the application is presented in a second orientation (e.g., the landscape orientation facing to the left side) based upon the second position of the second face.

Orientation selection

A method of battery charging is to be implemented by an energy station communicable with a cloud server that stores reference battery identifiers. The method includes: detecting a provided battery identifier of a battery, and transmitting the provided battery identifier to the cloud server so as to enable the cloud server to determine one of the reference battery identifiers that matches the provided battery identifier, and to determine to which one of a first lease code and a second lease codes the one of the reference battery identifiers thus determined corresponds; and being controlled to charge the battery when it is determined that the one of the reference battery identifiers thus determined by the cloud server corresponds to the first lease code.

Method of battery charging and energy station

A bean roasting apparatus with a stirring barrel body, a receiving structure and an image capturing assembly is provided. The stirring barrel body has an opening. The receiving structure has a bean-through opening and an observation opening. The image capturing assembly has at least one image capturing device and a reflective surface which is disposed in the capturing scope of the at least one image capturing device and is tilted facing the at least one image capturing device and the observation opening. Therefore, the at least one image capturing device can capture an image inside the receiving structure through the reflective surface and the observation opening. Another bean roasting apparatus with an image capturing assembly is provided, wherein at least one image capturing device of the image capturing assembly can capture an image inside the receiving structure through the observation opening directly.

Bean roasting apparatus

The present invention is related to an electrochemical paper towel sterilizing device, which mainly comprises: at least one sterilizing device, at least one first accommodating space, at least one water-inlet portion, at least one electrolytic component, at least one power-supply element, and at least one second accommodating space. In this way, the second accommodating space is provided with a dry wiping-object (such as a paper towel), and the user can add water into the first accommodating space via the water-inlet portion and electrolyze the water through the electrolytic component to generate the high active oxygen species, and combine the water and the high active oxygen species into the wiping-object, thereby producing a wet wiping-object with sterilizing effect.

Electrochemical paper towel sterilizing device

A method for radio frequency chain allocation. The method is utilized in a massive multiple-input multiple-output (MIMO) system. Specifically, a hybrid beamforming (HB) system in which the overall beamformer consists of a low-dimensional digital beamformer followed by an analog beamformer utilized the method to allocate RF chains to data streams. The total number of RF chains is not necessarily equal to the number of data streams to users.

Radio frequency chain allocation method and radio node device

The present teaching relates to user authentication based on a visual representation of a location. In one example, a request is received for authenticating a user with respect to a user identity. A location of the user is determined. A candidate visual representation of the location is obtained from the user. One or more visual representations are retrieved from a database. The retrieved one or more visual representations are associated with the user identity in the database. Whether the user is authenticated is determined based on the candidate visual representation and the retrieved one or more visual representations.

Method and system for user authentication based on a visual representation of user location

A layout pattern of a static random access memory (SRAM) includes a substrate, a first pull-up transistor (PL), a first pull-down transistor (PD), a second (PL), and a second pull-down transistor (PD) on the substrate, and a first pass gate transistor (PGA), a second pass gate transistor (PGB), a third pass gate transistor (PGA) and a fourth pass gate transistor (PGB), wherein the PGA and the PGB comprise a first fin structure, the PGA and the PGB comprise a second fin structure, a first local interconnection layer disposed between the PGA and the PGB and disposed on the fin structures of the PLand the PD, a second local interconnection layer disposed between the PGA and the PGB and disposed between the fin structures of the PLand the PD, the first local interconnection layer and the second local interconnection layer are monolithically formed structures respectively.

Static random access memory structure

A charging device includes a main control circuit, a connecting interface, a power supply circuit and a detecting circuit. When an energy storage element connects to the charging device, the connecting interface is coupled to two terminals of a temperature control element. The power supply circuit is coupled to the connecting interface and the main control circuit. The detecting circuit is coupled to the connecting interface. When the energy storage element connects to the charging device, the detecting circuit generates a detecting signal being used to trigger the power supply circuit to provide a main operating voltage to the main control circuit. When temperature of the energy storage element exceeds a threshold, the temperature control element makes the detecting circuit not to generate the detecting signal, so the power supply circuit ceases to provide the main operating voltage to the main control circuit.

Charging device and charging system

A back plate assembly and a backlight module are provided. The back plate assembly includes a back plate, at least one optical film and at least one fixing member. The back plate includes a bottom plate and a sidewall. The optical film is disposed on the bottom plate. The fixing member includes a main body and a protruding member. At least one portion of the main body overlaps with the sidewall. The protruding member is disposed on the main body and is combined with the optical film.

Back plate assembly and backlight module

An integrated circuit layout structure having dual-height standard cells includes at least a first standard cell including a first cell height and at least a second standard cell including a second cell height. The second cell height is one half of the first cell height. The first standard cell includes one first doped region formed in a middle of the first standard cell and a plurality of second doped regions formed at a top side and a bottom side of the first standard cell. The first doped region includes a first conductivity type and the second doped regions include a second conductivity type complementary to the first conductivity type. And an area of the first doped region is smaller than an area of the total second doped regions.

Integrated circuit layout structure

A battery charge apparatus and a charge system are disclosed. The charge apparatus includes first and second charge module connected to each other. The first charge module is connected to an auxiliary power, makes a processor thereof generate a charge-unit-address code for the charge unit thereof, and turns on an auxiliary switch thereof for transmitting the auxiliary power to the second charge module for activated the second charge module. The second charge module then sends a charge-module-address request to the first charge module to ask for a charge-module-address code. Thereafter, the first charge module performs charge procedure and informs the second charge module to perform charge procedure when battery connected to the first charge module is fully charged. The second charge module then performs charge procedure and sends fully charged information to the first charge module when the battery connected to the second charge module is fully charged.

Battery charge apparatus and charge system

Growing community of inventors

Taipei, Taiwan

Chien-Hung Zordius Chen