Cooler Master Co., Ltd.

Cooler Master Development Corporation

Chien-Hung Sun

Lei-Lei Liu

Te-Hsuan Chin

Xiao-Min Zhang

Tzu-Wei Gu

Leilei Liu

Xiaomin Zhang

Chun Zhou

A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.

Heat pipe module and heat dissipating device using the same

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Thermal conducting structure

A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.

Anti-gravity heat pipe device

A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

Manufacturing method of three-dimensional heat conducting structure

A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.

Cooling module, water-cooled cooling module and cooling system

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board. A first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can provide the desired heat dissipation effect.

Communication-type thermal conduction device

A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.

Three-dimensional heat transfer device

In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.

Three-dimensional heat conducting structure and manufacturing method thereof

A heat dissipater having capillary component includes: a heat spreader including a shell member having at least one through hole and a first capillary structure disposed in the shell member; a heat pipe, received in the through hole and including a pipe member and a second capillary structure disposed in the pipe member. The pipe member includes an opening formed in the shell member; and a capillary component, accommodated in the shell member and including a block member extended with a protruding part and arranged adjacent to the first capillary structure. The protruding part is received in the opening and arranged adjacent to the second capillary structure. Accordingly, the heat pipe and the heat spreader can be combined for operation, and an internal working fluid can flow between the heat pipe and the heat spreader.

Heat dissipater having capillary component

The heat sink structure includes a vapor chamber, a heat pipe, and capillary elements. The vapor chamber includes a housing, a first capillary structure covering inside the housing, and a first working fluid filled inside the housing. The housing includes through holes and an inner top wall. Both ends of the heat pipe are inserted through the two through holes respectively and are exposed from the housing. The heat pipe includes a pipe body, a second capillary structure covering inside the pipe body, and a second working fluid filled inside the pipe body. Each of the capillary elements is connected to the inner top wall. One end of each of the capillary elements is in contact with the first capillary structure, and the other end of each of the capillary elements is in thermal contact with the heat pipe.

Heat sink structure with heat exchange mechanism

A loop heat pipe structure with a liquid and vapor separation includes an evaporation chamber and a loop pipe. The evaporation chamber includes two connecting ports, and an inner wall of the evaporation chamber includes a liquid-preservation capillary structure. The loop pipe includes two evaporation channel tubular portions and a condensation tubular portion connected between the two evaporation channel tubular portions; and the two evaporation channel tubular portions are connected to the two connecting ports of the evaporation chamber respectively. Wherein each one of the evaporation channel tubular portions includes an inner tube and an outer tube; the inner tube is sleeved inside the outer tube; and a flow-returning capillary structure is disposed between the outer tube and the inner tube inside the outer tube; the flow-returning capillary structure extends into the evaporation chamber and is in contact with the liquid-preservation capillary structure.

Loop heat pipe structure with liquid and vapor separation

A flat heat pipe includes a flat hollow pipe and a capillary structure. The flat hollow pipe has a first flat portion, a second flat portion and two arc portions, wherein the two arc portions are connected to both sides of the first and second flat portions. The capillary structure is formed in the flat hollow pipe. The capillary structure has a central portion and two edge portions, wherein the central portion is located on an inner wall of the first flat portion, the two edge portions are located on inner walls of the two arc portions respectively, and a thickness of the central portion is smaller than a thickness of each of the two edge portions.

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Taipei, Taiwan

Chien-Hung Sun