Quanta Computer Incorporated

Taiwan Semiconductor Manufacturing Comp. Ltd.

Htc Corporation

Tdk Taiwan Corporation

Other

Mediatek Corporation

E Ink Holdings Inc.

Qisda Corporation

Interface Optoelectronics (shenzhen) Co., Ltd.

General Interface Solution Limited

Interface Technology (chengdu) Co., Ltd.

Phosertek Corporation

Tsinghua University

Faraday Technology Corporation

Everwin Pneumatic Corporation

Chien-Hung Lin

Feng-Lung Chien

Hsiang-Hui Hsu

Jung-Wen Chang

Chun-Lung Chu

Cheng-Chieh Chuang

Tim Chung-Ting Wu

Chi-Jen Lu

Mao-Chun Chen

Ni-Ni Lai

Yun-Cheng Liu

Shih-Chi Kuo

Chun-Chieh Mo

Kuo-Jui Lee

Chia-Yuan Chang

Chin-Hsiang Lin

Su-Hao Liu

Ian French

Pei-Kuei Tsung

Chee-Chun Leung

Yang-Sheng Wang

Wei-Yu Chen

Tzu-Huan Hsu

Wen-Pin Liu

Chen-Kuang Liu

Ya-Ping Chen

Tsang-Feng Wu

Kun-Ying Lee

Chris T Burket

Yuan Han

Sung Jen Wang

ShengJe Hung

Chun-Jen Hsiao

Chen-Kuan Lin

Chin-Wen Chen

Chien-Ming Tseng

Meng-Hsuan Cheng

Bo-Tsun Chou

Horng-Huei Tseng

Ching-Yu Chang

Ziwei Fang

Jeng-Horng Chen

Burn Jeng Lin

Feng-Jia Shiu

Kao-Yu Hsu

Chia-Hui Lin

Tsai-Hao Hung

Li-Hsun Chang

Ching-Sen Kuo

Zi-Wei Fang

Chun-Chang Chen

Po-Yu Chen

Fu-Jye Liang

Burn-Jeng Lin

Jia-Hung Chen

Chih-Chien Wang

Chi-Ming Chen

Hung-Yin Tsai

Chung-Hsing Chang

Shao-Yu Wang

Shu-Fen Tsai

Bo-Yi Wu

Hsu-Hung Chen

Yao-Sheng Wang

David Lu

Meng-Chang Liu

Kuang-Heng Liang

Bang-Ching Ho

Jyh-Feng Lin

Chihy-Yuan Cheng

Yu-Ting Kuo

Sz-Fan Chen

Wei-Lin Chang

Yu-Ching Chen

Yen-Chieh Wang

Hong Hocheng

Chih-Cheng Chin

Kuo-Jui Lin

Xian-Teng Chung

Yi-Lung Wen

Ker-Hsun Liao

San-Long Lin

Chih-Tsang Yeh

Ji-Yuan Li

Yen-Ji Chen

Wei-Hao Chiao

Sheng-Long Lin

Tao-Feng Chen

Jer-Shien Yang

Li-An Chu

Yu-Ching Lin

Sheng-Wen Hu

Chih-Chieh Tsung

Wei-Han Huang

Po-An Yang

Yung-Chi Hsu

Hsing-Ju Wei

Rong-Shun Chen

Yu-chen Chen

Su-Ying Su

A wireless transmission module corresponds to an electronic module and is configured to transmit a first signal. The wireless transmission module includes a corresponding surface, a base assembly, and a first coil. The corresponding surface faces the electronic module and is perpendicular to a main axis. The first coil is disposed on the base assembly. The first coil overlaps at least a portion of the base assembly when viewed along the main axis. The first coil overlaps at least a portion of the base assembly when viewed in a direction that is perpendicular to the main axis.

Wireless transmission module

A non-contact elevator control system having a control panel with multiple buttons, an image processor, a first and a second camera module, wherein the first and second camera modules are arranged at two adjacent corners of the control panel, is disclosed. When an object enters a detection range, the image processor obtains a first imaging position of the object based on a first image taken by the first camera module and a second imaging position of the object based on a second image taken by the second camera module. The image processor calculates the corresponding position of the object in the control panel according to the first and the second imaging positions, and the relative position information of the first and second imaging positions with respect to the first and second camera modules. The image processor triggers a corresponding button in the control panel based on the position.

Non-contact elevator control system

A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Coil module

A speaker module is adapted to be configured to a wearable device. The speaker module includes an enclosure and a driving unit. The driving unit is used to generate sound. The enclosure contains the driving unit. A sound sum of the sound output from a front opening, a first rear opening and a second rear opening of the enclosure has directivity. The connection vectors and the inverse vector of the connection normal vector defined by these openings are added to form a combined vector. A unit vector of the combination vector and a unit vector of a front normal vector facing outwards of the front opening are added to form a sum vector. The direction of the sum vector is the direction of the sound sum.

Speaker module and wearable device

A laser device includes a substrate, a first waveguiding layer, an active layer, a second waveguiding layer, a contact layer, an insulating layer, a light-transmissive conducting layer, a first electrode, and a second electrode. The first waveguiding layer, the active layer, the second waveguiding layer, and the contact layer form an epitaxy structure having a first platform and a second platform. The first platform has multiple holes to form a photonic crystal structure. The insulating layer is over an upper surface and a sidewall surface of the first platform, and over an upper surface of the second platform. The sidewall surface passes through the contact layer, the second waveguiding layer, and the active layer. The light-transmissive conducting layer connects to the photonic crystal structure through an aperture of the insulating layer. The first electrode has an opening corresponding to the aperture. The second electrode is under the substrate.

Laser device and method of manufacturing the same

Integrated semiconductor devices and method of making the integrated semiconductor are disclosed. The integrated semiconductor device may include a first transistor comprising a first gate and at least one first active region, a second transistor comprising a second gate and at least one second active region, wherein the second transistor is spaced a first distance from the first transistor, a dielectric sidewall spacer formed on a gate sidewall of the first transistor and a gate sidewall of the second transistor, a first dielectric layer formed over the first transistor and the second transistor, wherein a thickness of the first dielectric layer is greater than half the first distance, and a patterned metal layer formed on the first dielectric layer and partially covering the second gate.

Metal field plates

A wireless device is provided and includes a substrate, a first coil and a second coil. The first coil is configured to be wound around a first axis, and the first coil is disposed on the substrate and is configured to operate in a wireless charging mode. The second coil is disposed on the substrate and configured to operate in a wireless communication mode. The wires of the second coil partially overlap the wires of the first coil.

An active array substrate includes a substrate and a plurality of pixel structure disposed on the substrate. Each of the pixel structure includes a scan line, a data line, and a pixel electrode. The scan line is disposed on the substrate and extending along a first direction. The data line is disposed on the substrate and extending along a second direction. The first direction crosses the second direction. The data line and the scan line define a pixel region and a first cutting clearance region. The pixel electrode is disposed on the substrate and includes a first portion and a second portion. The first portion is on the pixel region. The second portion is on the first cutting clearance region. A normal projection of the second portion onto the substrate does not overlap a normal projection of the data line onto the substrate.

Active array substrate and fabricating method thereof

An auscultation device includes an electrocardiogram (ECG) device, a sound receiver device, a synchronization device and a processor. The ECG device is configured to receive an ECG signal. The sound receiver device is configured to receive a heart sound signal. The synchronization device is configured to transmit a synchronization signal to the ECG device and the sound receiver device, so that the ECG device starts to receive the ECG signal and the sound receiver device starts to receive the heart sound signal in time synchronization. Moreover, the processor is configured to generate an ECG according to the ECG signal, generate a heart sound diagram according to the heart sound signal, and generate a synchronization timing diagram according to the ECG and the heart sound diagram.

Auscultation device and auscultation method using auscultation device

A semiconductor device and method for making the semiconductor device comprising a flash memory cell is provided. In accordance with some embodiments, the method includes: patterning a first gate material layer and a gate insulating film over a substrate, the first gate material layer comprising a first gate material, the gate insulating film disposed on the first gate material layer; forming a second gate material layer over the substrate, the gate insulating film, and side walls of the first gate material layer, the second gate material layer comprising a second gate material; etching the second gate material layer to expose the substrate and the gate insulating film and provide a portion of the second gate material layer along each of the side walls of the first gate material layer; and etching the gate insulating film and the first gate material layer so as to form a plurality of gate structures.

Method of making semiconductor device comprising flash memory and resulting device

A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.

Metallic housing of electronic device

Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Method for reducing charging of semiconductor wafers

The disclosure provides a method and a host for adjusting audio of speakers, and a computer readable medium. The method includes: controlling a far-field speaker to play a first audio signal; controlling an audio receiver to receive the first audio signal from the far-field speaker and accordingly positioning a speaker location of the far-field speaker; establishing a first hearing transfer function related to the far-filed speaker based on the speaker location of the far-filed speaker; controlling the far-field speaker to play a second audio signal based on a second hearing transfer function; controlling the audio receiver to receive the second audio signal and accordingly estimating a first reference hearing volume; obtaining a second reference hearing volume corresponding to a first near-field speaker; and adjusting a first volume of the far-field speaker based on the first reference hearing volume and the second reference hearing volume.

Method and host for adjusting audio of speakers, and computer readable medium

A plasma ashing method is provided. The plasma ashing method includes analyzing the process status of each of a number of semiconductor substrate models undergoing a tested plasma ash process by a residue gas analyzer. The tested plasma ash processes for the semiconductor substrate models utilize a plurality of tested recipes. The plasma ashing method further includes selecting one of the tested recipes as a process recipe for a plasma ash process.

Plasma ashing method using residue gas analyzer

Growing community of inventors

Taoyuan, Taiwan

Chien-Hung Lin