Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Other

Samsung Electronics Co., Ltd.

Chien-Hua Chen

Michael W Cumbie

Devin Alexander Mourey

Charles Craig Haluzak

Viktor Shkolnikov

Michael G Groh

Silam J Choy

James McKinnell

Si-lam Choy

David M Craig

Anthony M Fuller

Zhizhang Chen

Kirby Sand

Qin Liu

Jeffrey R Pollard

Stephen Farrar

Brett E Dahlgren

Kenneth Michael Kramer

James Richard Przybyla

Donald W Schulte

Michael A Pate

Diane R Hammerstad

Arun K Agarwal

Ronald A Hellekson

John Liebeskind

Si-Iam J Choy

Anthony Donald Studer

Erik D Torniainen

Naoto A Kawamura

Terry E McMahon

Arthur Piehl

Eric Lee Nikkel

Michael G Monroe

Donald J Milligan

John R Sterner

Kenneth A Diest

Ning Ge

Eric T Martin

Daryl E Anderson

Paul H McClelland

Kenneth E Trueba

Garrett E Clark

James Elmer Abbott, Jr

Sriram Ramamoorthi

Donald L Michael

Daniel A Kearl

Gary G Lutnesky

Neal W Meyer

Antonio Cruz-Uribe

Robert Newton Bicknell

Timothy F Myers

Ellen R Tappon

Thomas R Strand

Stuart D Asakawa

William R Boucher

Stephen Jalrus Potochnik

Barry Craig Snyder

Jennifer Shih

Alexander N Govyadinov

Bruce Cowger

Randy Hoffman

Timothy L Weber

Mark H MacKenzie

Scott A Lerner

James W Ring

Jeffrey Allen Nielsen

Sterling Chaffins

Greg Scott Long

Paul J Benning

Jeremy Harlan Donaldson

Robert N K Browning

Richard W Seaver

Martha A Truninger

Colin C Davis

Michael John Regan

Kenneth James Faase

Sadiq Bengali

Jeffery S Hess

Galen P Cook

Donald E Wenzel

Jeffrey Scott Obert

Gary J Watts

Teressa L Roth

Kuohua Wu

Paul F Reboa

Colby Van Vooren

Hilary Ely

Reynaldo V Villavelez

Bao-Sung Bruce Yeh

Adam Higgins

Ronnie Yenchik

Bradley B Branham

Murali Chaparala

David Douglas Hall

James Denning Smith

Si-Lam J Choy

Rachel M White

Joshua W Smith

Jimmy Perez

James E Abbott

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

Fluid ejection device with break(s) in cover layer

An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

Thermally controlled reagent release

In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

Microfluidic devices

A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Processes for formation of molded panels by bringing release liner of mold chase in direct contact with protective layer

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Molded structures with channels

A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Fluid-ejection die with stamped nanoceramic layer

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

Coplanar modular printbars

The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.

Microfluidic devices with lid for loading fluid

A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

Applying mold chase structure to end portion of fluid ejection die

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Three-dimensional features formed in molded panel

A fluid ejection device can include a nozzle plate incorporating a non-coplanar surface. The non-coplanar surface can include a hydrophilic region of a hydrophilic material having a water contact angle from about 50&#xb0; to about 90&#xb0; and a hydrophobic coating including a hydrophobic material having a water contact angle from about 91&#xb0; to about 160&#xb0;.

Fluid ejection devices

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

Circuit die alignment target

A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.

Fluid circulation and ejection

Growing community of inventors

Corvallis, OR, United States of America

Chien-Hua Chen