Mstar Semiconductor, Inc.

United Microelectronics Corp.

Lian Hsing Plastic Industrial Co., Ltd.

Chien-Hsing Lin

Chih-Tien Chang

Shao Ping Hung

Po Lin Yeh

Jui-Hua Yeh

Chun-Chia Chen

Wei Ling Chang

Hsu-Hung Chang

Chi-Han Lan

The present invention discloses a mouthguard with light emitting function. The mouthguard with light emitting function includes an occlusion unit which is bitten by teeth between the maxilla and the mandible of a wearer. A front end of the occlusion unit is provided with a protector which includes a holding chamber. The mouthguard also includes a lower cap, which is disposed in the holding chamber of the protector; an electric module, which is disposed in the lower cap and includes a control circuit, light emitting devices and a push button; and an upper cap, which covers the electric module to clip and fix with the lower cap. By pressing the push button, the light emitting devices are activated to emit light, thereby achieving the effect of alerting and highlighting.

Mouthguard with light emitting function

A determining method and apparatus thereof for a transition point of a sequence which can be applied to a decoder. The determining method determines the transition point of the sequence having N numbers, wherein the sequence is composed of a first value and a second value and N is a positive integer. The determining method includes determining the position the first value appearing consecutively in the sequence to determine a first interval; determining the position the second value appearing consecutively in the sequence to determine a second interval; and determining the longer interval between the first interval and the second interval, when the first interval is longer, determining an adjacency of the first interval and the second value as the transition point according to the first interval, and when the second interval is longer, determining an adjacency of the second interval and the first value as the transition point.

Sequence transition point determining method and apparatus thereof

An RFID chip is modified with set data before being disposed in an electronic label so as to allow the electronic label to be selectively used with different types of RFID systems. The RFID chip includes a first data storage zone for storing first data set accessible by the first type of RFID system and the second type of RFID system; and a second data storage zone for storing second data set inaccessible by the first type of RFID system and the second type of RFID system. The second data set includes a modifiable code for indicating a type of the electronic label and with which of the first type of RFID system and the second type of RFID system the electronic label is to be used.

Radio frequency identification chip and setting and operating methods of same

A phase digitizing apparatus for generating a corresponding digital value in response to a phase of an input signal is provided. The phase digitizing apparatus includes a coarse phase generator, for generating a coarse phase code according to the phase of the input signal and a first time unit; a fine phase code generator, for generating a fine phase code according to the phase of the input signal and a second time unit; and a calculating unit, for generating the digital value according to the coarse phase code and the fine phase code; wherein the first time unit is greater than the second time unit.

Phase digitizing apparatus and method thereof

A method for improving package bonding between multi-level interconnection lines and low K inter-metal dielectric is provided. The present invention includes the steps of forming a trench between each pair of interconnection lines on one level of multi-level interconnection lines, and then filling the trench with an oxide dielectric material, instead of the low K inter-metal dielectric having a K value smaller than 3 filled therein before the trench formation. Since the oxide dielectric material has a K value higher than the low K inter-metal dielectric, the oxide dielectric is hard enough to resist the force of the package bonding. Accordingly, the relibility of bondability between the multi-level interconnection lines and the low K inter-metal dielectric is enhanced.

Method for improving package bonding between multi-level interconnection lines and low K inter-metal dielectric

A method of forming a copper dual damascene structure is disclosed. The method comprises forming copper lead lines and copper contacts simultaneously and selectively depositing tungsten layers on silicide layers formed on the active regions to complete the copper dual damascene structure and avoid the diffusion of copper into the active regions.

Growing community of inventors

Taichung, Taiwan

Chien-Hsing Lin