Lextar Electronics Corporation

Chien-Hsin Tu

Kun-Hsiung Wang

Ching-Chi Chiang

Wei-Yi Hsu

A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

LED package structure

A light-emitting diode includes an electrical connecting base, a lamp holder, a power driving module, an adapter plate and a lamp plate. One end of the lamp holder is connected to the electrical connecting base and the other end of the lamp holder is configured to be a supporting surface. The electrical connecting base and the lamp holder form an accommodation space which accommodates the power driving module. The adapter plate has a first surface and a second surface opposite to each other. The first surface is contacted with the supporting surface and the second surface includes a first connector which has a plugging direction parallel to the second surface. The lamp plate has a second connector which is detachably plugged to the first connector, so as to be disposed on the adapter plate.

Light emitting diode bulb

A light emitting device comprising a carrier, a first and a second reflective layers, a first and a second micro-structures, a LED package device, a light guide device and a light directing cover is provided. The carrier comprises an upper plate and a lower plate each having a first surface and a second surface. The lower plate has a through hole. The first and second reflective layers are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The first and second micro-structures are formed on the edges of the second surface of the upper plate and the first surface of the lower plate, respectively. The LED package device is disposed below the through hole. The light guide device is connected to the LED package device. The light directing cover surrounds the light guide device.

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Taipei, Taiwan

Chien-Hsin Tu