Taiwan Semiconductor Manufacturing Comp. Ltd.

Young Lighting Technology Corporation

Alpha Networks Inc.

Wirex Corporation

Chien-Hsiang Chen

Cheng-Yi Huang

Chih-Shen Yang

Hsu-Shui Liu

Ming-Dah Liu

Yen-Ji Chen

Der-Jen Sun

Chien-Hwa Chiu

Jen-hung Yang

Shih-fang Ao

Fu-Ti Shiang

Yen-Huey Hsu

Fu-Zen Lin

Paul S Wu

Ching-Horng Chen

Chia-shuo Yeh

A method for estimating distribution of wireless signal strength, selecting measuring locations to measure wireless signal strength and compensating estimated wireless signal strength is provided, wherein the method for estimating distribution of wireless signal strength estimates the wireless signal strength at an estimation location in accordance with a plurality of single-reflection paths started from a signal emitter, the method for selecting position for measuring wireless signal strength determines whether a signal measuring process should be performed at the specific location, and the method for compensating estimated wireless signal strength compensates an estimated wireless signal strength near a specific location in accordance with a signal strength value measured at the specific location.

Method for estimating distribution of wireless signal strength, selecting measuring locations to measure wireless signal strength and compensating estimated wireless signal strength

A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.

Semiconductor processing apparatus for generating plasma

A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.

Semiconductor chuck and method of making

A light guide plate and a side-emitting backlight module having the same are disclosed. The light guide plate includes a transparent substrate, a plurality of prisms and a plurality of condensing lenses. The prisms are arranged side by side on one surface of the transparent substrate. The condensing lenses are disposed between two adjacent prisms, and distributed from sparsely to densely along a direction of a crest line of each of the prisms.

Light guide plate and side-emitting backlight module having the same

A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.

Polyimide resin for cast on copper laminate and laminate produced

Growing community of inventors

Hsinchu, Taiwan

Chien-Hsiang Chen