Industrial Technology Research Institute

Chien-Chou Tseng

Chih-Chia Chang

Ming-Huan Yang

Tai-Jui Wang

Chieh-Wei Feng

Yu-Lin Hsu

Yu-Hua Chung

Yu-Ming Peng

Kuan-Chu Wu

Chien-Hsun Chu

An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

Electronic device and method of manufacturing electronic device

A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.

Panel to be plated, electroplating process using the same, and chip manufactured from the same

Growing community of inventors

Hsinchu, Taiwan

Chien-Chou Tseng